Inventor · disambiguated record
Eric A. Joseph
Also filed as: JOSEPH ERIC · JOSEPH ERIC A · JOSEPH ERIC ANDREW
94 granted patents·14 pending applications·888 citations·filing 2001–2023
99Inventor score
Top patents by PatentIndex Score
108 records- 0198US9493879B2Selective sputtering for pattern transferAPPLIED MATERIALS INC·Filed 2013·Granted Nov 15, 2016·132 cites·15 claims
- 0298US9114438B2Copper residue chamber cleanAPPLIED MATERIALS INC·Filed 2013·Granted Aug 25, 2015·184 cites·13 claims
- 0397US8338225B2Method to reduce a via area in a phase change memory cellBREITWISCH MATTHEW J·Filed 2012·Granted Dec 25, 2012·30 cites·14 claims
- 0496US9799519B1Selective sputtering with light mass ions to sharpen sidewall of subtractively patterned conductive metal layerIBM·Filed 2016·Granted Oct 24, 2017·17 cites·18 claims
- 0596US7560721B1Phase change material with filament electrodeIBM·Filed 2008·Granted Jul 14, 2009·42 cites·15 claims
- 0695US9705077B2Spin torque MRAM fabrication using negative tone lithography and ion beam etchingIBM·Filed 2015·Granted Jul 11, 2017·7 cites·16 claims
- 0795US8138028B2Method for manufacturing a phase change memory device with pillar bottom electrodeLUNG HSIANG LAN·Filed 2007·Granted Mar 20, 2012·25 cites·27 claims
- 0894US8728859B2Small footprint phase change memory cellBREITWISCH MATTHEW J·Filed 2010·Granted May 20, 2014·14 cites·16 claims
- 0994US8633117B1Sputter and surface modification etch processing for metal patterning in integrated circuitsIBM·Filed 2012·Granted Jan 21, 2014·14 cites·20 claims
- 1094US8470628B2Methods to fabricate silicide micromechanical deviceGUILLORN MICHAEL A·Filed 2011·Granted Jun 25, 2013·11 cites·16 claims
- 1194US7485487B1Phase change memory cell with electrodeIBM·Filed 2008·Granted Feb 3, 2009·28 cites·17 claims
- 1293US8471236B2Flat lower bottom electrode for phase change memory cellBREITWISCH MATTHEW J·Filed 2012·Granted Jun 25, 2013·12 cites·9 claims
- 1393US8431486B2Interconnect structure for improved time dependent dielectric breakdownCABRAL JR CYRIL·Filed 2010·Granted Apr 30, 2013·15 cites·19 claims
- 1492US9786550B2Low resistance metal contacts to interconnectsIBM·Filed 2015·Granted Oct 10, 2017·8 cites·11 claims
- 1592US8871107B2Subtractive plasma etching of a blanket layer of metal or metal alloyIBM·Filed 2013·Granted Oct 28, 2014·13 cites·24 claims
- 1692US8809828B2Small footprint phase change memory cellIBM·Filed 2014·Granted Aug 19, 2014·10 cites·4 claims
- 1790US6624068B2Polysilicon processing using an anti-reflective dual layer hardmask for 193 nm lithographyTEXAS INSTRUMENTS INC·Filed 2001·Granted Sep 23, 2003·64 cites·15 claims
- 1889US8884387B2Pillar-based interconnects for magnetoresistive random access memoryASSEFA SOLOMON·Filed 2012·Granted Nov 11, 2014·6 cites·14 claims
- 1989US8105859B2In via formed phase change memory cell with recessed pillar heaterBREITWISCH MATTHEW J·Filed 2009·Granted Jan 31, 2012·16 cites·8 claims
- 2088US9786597B2Self-aligned pitch split for unidirectional metal wiringIBM·Filed 2013·Granted Oct 10, 2017·8 cites·12 claims
- 2188US8633464B2In via formed phase change memory cell with recessed pillar heaterBREITWISCH MATTHEW J·Filed 2012·Granted Jan 21, 2014·7 cites·8 claims
- 2288US8288236B2Field effect transistor having nanostructure channelCHANG JOSEPHINE B·Filed 2012·Granted Oct 16, 2012·8 cites·12 claims
- 2388US8030130B2Phase change memory device with plated phase change materialIBM·Filed 2009·Granted Oct 4, 2011·14 cites·16 claims
- 2487US8283650B2Flat lower bottom electrode for phase change memory cellBREITWISCH MATTHEW J·Filed 2009·Granted Oct 9, 2012·12 cites·5 claims
- 2587US7910911B2Phase change memory with tapered heaterIBM·Filed 2009·Granted Mar 22, 2011·12 cites·10 claims
- 2686US10128185B2Hybrid subtractive etch/metal fill process for fabricating interconnectsIBM·Filed 2017·Granted Nov 13, 2018·3 cites·19 claims
- 2786US8330137B2Pore phase change material cell fabricated from recessed pillarSCHROTT ALEJANDRO G·Filed 2011·Granted Dec 11, 2012·6 cites·20 claims
- 2885US9646881B2Hybrid subtractive etch/metal fill process for fabricating interconnectsIBM·Filed 2016·Granted May 9, 2017·3 cites·20 claims
- 2984US9583401B2Nano deposition and ablation for the repair and fabrication of integrated circuitsIBM·Filed 2014·Granted Feb 28, 2017·2 cites·10 claims
- 3084US9484220B2Sputter etch processing for heavy metal patterning in integrated circuitsIBM·Filed 2013·Granted Nov 1, 2016·6 cites·24 claims
- 3184US7960203B2Pore phase change material cell fabricated from recessed pillarIBM·Filed 2008·Granted Jun 14, 2011·9 cites·18 claims
- 3282US9171796B1Sidewall image transfer for heavy metal patterning in integrated circuitsIBM·Filed 2014·Granted Oct 27, 2015·5 cites·19 claims
- 3382US8686391B2Pore phase change material cell fabricated from recessed pillarSCHROTT ALEJANDRO G·Filed 2012·Granted Apr 1, 2014·4 cites·17 claims
- 3482US8652969B2High aspect ratio and reduced undercut trench etch process for a semiconductor substrateFULLER NICHOLAS C M·Filed 2011·Granted Feb 18, 2014·6 cites·25 claims
- 3580US10121676B2Interconnects fabricated by hydrofluorocarbon gas-assisted plasma etchIBM·Filed 2017·Granted Nov 6, 2018·2 cites·19 claims
- 3680US8796041B2Pillar-based interconnects for magnetoresistive random access memoryASSEFA SOLOMON·Filed 2009·Granted Aug 5, 2014·5 cites·8 claims
- 3780US7906368B2Phase change memory with tapered heaterIBM·Filed 2007·Granted Mar 15, 2011·8 cites·12 claims
- 3880US6803661B2Polysilicon processing using an anti-reflective dual layer hardmask for 193 nm lithographyTEXAS INSTRUMENTS INC·Filed 2003·Granted Oct 12, 2004·23 cites·3 claims
- 3979US10170361B2Thin film interconnects with large grainsIBM·Filed 2014·Granted Jan 1, 2019·4 cites·16 claims
- 4078US8993907B2Silicide micromechanical device and methods to fabricate sameIBM·Filed 2012·Granted Mar 31, 2015·2 cites·20 claims
- 4178US8426967B2Scaled-down phase change memory cell in recessed heaterJOSEPH ERIC ANDREW·Filed 2007·Granted Apr 23, 2013·11 cites·13 claims
- 4277US9728421B2High aspect ratio patterning of hard mask materials by organic soft masksIBM·Filed 2015·Granted Aug 8, 2017·2 cites·16 claims
- 4376US9911648B2Interconnects based on subtractive etching of silverIBM·Filed 2016·Granted Mar 6, 2018·2 cites·16 claims
- 4476US9799552B2Low resistance metal contacts to interconnectsIBM·Filed 2015·Granted Oct 24, 2017·2 cites·8 claims
- 4576US9064727B2Sputter and surface modification etch processing for metal patterning in integrated circuitsIBM·Filed 2013·Granted Jun 23, 2015·2 cites·19 claims
- 4676US8900975B2Nanopore sensor deviceIBM·Filed 2013·Granted Dec 2, 2014·3 cites·19 claims
- 4776US8536675B2Thermally insulated phase change material memory cellsBREITWISCH MATTHEW J·Filed 2012·Granted Sep 17, 2013·2 cites·2 claims
- 4874US10600656B2Directed self-assembly for copper patterningIBM·Filed 2017·Granted Mar 24, 2020·2 cites·10 claims
- 4974US9564362B2Interconnects based on subtractive etching of silverIBM·Filed 2015·Granted Feb 7, 2017·2 cites·14 claims
- 5074US7709325B2Method of forming ring electrodeIBM·Filed 2008·Granted May 4, 2010·6 cites·19 claims
Showing the top 50 of 108 patent records by PatentIndex Score.
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