Inventor · disambiguated record
Adeline Ai Lin Kung
Also filed as: KUNG ADELINE AI LIN
6 granted patents·3 pending applications·60 citations·filing 2008–2017
84Inventor score
Files withANSELL HEALTHCARE PROD LLC3ANSELL LTD2LUCAS DAVID M2LIFESTYLES HEALTHCARE PTE LTD1SXWELL AUSTRALIA PTY LTD1
Top patents by PatentIndex Score
9 records- 0193US9074027B2Dip-formed synthetic polyisoprene latex articles with improved intraparticle and interparticle crosslinksANSELL HEALTHCARE PROD LLC·Filed 2013·Granted Jul 7, 2015·10 cites·20 claims
- 0293US8087412B2Dip-formed synthetic polyisoprene latex articles with improved intraparticle and interparticle crosslinksLUCAS DAVID M·Filed 2008·Granted Jan 3, 2012·26 cites·27 claims
- 0392US9074029B2Dip-formed synthetic polyisoprene latex articles with improved intraparticle and interparticle crosslinksANSELL HEALTHCARE PROD LLC·Filed 2014·Granted Jul 7, 2015·9 cites·20 claims
- 0492US8464719B2Dip-formed synthetic polyisoprene latex articles with improved intraparticle and interparticle crosslinksLUCAS DAVID M·Filed 2011·Granted Jun 18, 2013·10 cites·20 claims
- 0581US10538609B2Dip-formed synthetic polyisoprene latex articles with improved intraparticle and interparticle crosslinksLIFESTYLES HEALTHCARE PTE LTD·Filed 2017·Granted Jan 21, 2020·3 cites·3 claims
- 0677US9725539B2Dip-formed synthetic polyisoprene latex articles with improved intraparticle and interparticle crosslinksANSELL HEALTHCARE PROD LLC·Filed 2015·Granted Aug 8, 2017·2 cites·26 claims
- 0745US2013152943A1Condom having a raised contoured surface and method and apparatus for manufacturingANSELL LTD·Filed 2012·Application pending·0 cites
- 0845US2016279839A1Condom having a raised contoured surface and method and apparatus for manufacturingANSELL LTD·Filed 2016·Application pending·0 cites
- 0941US2018029259A1Condom Having A Raised Contoured Surface And Method And Apparatus For ManufacturingSXWELL AUSTRALIA PTY LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →