Inventor · disambiguated record
Katherine G. Heinen
Also filed as: HEINEN KATHERINE G · HEINEN KATHERINE GAIL
27 granted patents·1 pending application·996 citations·filing 1990–2002
97Inventor score
Top patents by PatentIndex Score
28 records- 0192US5458716AMethods for manufacturing a thermally enhanced molded cavity package having a parallel lidTEXAS INSTRUMENTS INC·Filed 1994·Granted Oct 17, 1995·136 cites·10 claims
- 0290US5233220ABalanced capacitance lead frame for integrated circuits and integrated circuit device with separate conductive layerTEXAS INSTRUMENTS INC·Filed 1992·Granted Aug 3, 1993·113 cites·25 claims
- 0389US5321277AMulti-chip module testingTEXAS INSTRUMENTS INC·Filed 1993·Granted Jun 14, 1994·84 cites·15 claims
- 0485US5418189AIntegrated circuit device and method to prevent cracking during surface mountTEXAS INSTRUMENTS INC·Filed 1994·Granted May 23, 1995·68 cites·3 claims
- 0583US5442233APackaged semiconductor device and a lead frame therefor, having a common potential lead with lead portions having dual functions of chip support and heat dissipationHITACHI LTD·Filed 1992·Granted Aug 15, 1995·55 cites·28 claims
- 0682US5227661AIntegrated circuit device having an aminopropyltriethoxysilane coatingTEXAS INSTRUMENTS INC·Filed 1990·Granted Jul 13, 1993·58 cites·8 claims
- 0780US6432744B1Wafer-scale assembly of chip-size packagesTEXAS INSTRUMENTS INC·Filed 1998·Granted Aug 13, 2002·62 cites·9 claims
- 0877US5432127AMethod for making a balanced capacitance lead frame for integrated circuits having a power bus and dummy leadsTEXAS INSTRUMENTS INC·Filed 1993·Granted Jul 11, 1995·48 cites·9 claims
- 0976US5650915AThermally enhanced molded cavity package having a parallel lidTEXAS INSTRUMENTS INC·Filed 1996·Granted Jul 22, 1997·45 cites·14 claims
- 1076US5359224AInsulated lead frame for integrated circuits and method of manufacture thereofTEXAS INSTRUMENTS INC·Filed 1993·Granted Oct 25, 1994·54 cites·17 claims
- 1174US5894173AStress relief matrix for integrated circuit packagingTEXAS INSTRUMENTS INC·Filed 1997·Granted Apr 13, 1999·49 cites·13 claims
- 1272US5585665APackaged semiconductor device and a leadframe thereforHITACHI LTD·Filed 1995·Granted Dec 17, 1996·31 cites·9 claims
- 1366US6730541B2Wafer-scale assembly of chip-size packagesTEXAS INSTRUMENTS INC·Filed 1998·Granted May 4, 2004·33 cites·7 claims
- 1465US5994169ALead frame for integrated circuits and process of packagingTEXAS INSTRUMENTS INC·Filed 1998·Granted Nov 30, 1999·32 cites·5 claims
- 1563US5422788ATechnique for enhancing adhesion capability of heat spreaders in molded packagesTEXAS INSTRUMENTS INC·Filed 1994·Granted Jun 6, 1995·28 cites·24 claims
- 1655US6251767B1Ball grid assembly with solder columnsTEXAS INSTRUMENTS INC·Filed 1999·Granted Jun 26, 2001·17 cites·11 claims
- 1752US5840599AProcess of packaging an integrated circuit with a conductive material between a lead frame and the face of the circuitTEXAS INSTRUMENTS INC·Filed 1994·Granted Nov 24, 1998·17 cites·10 claims
- 1851US5362680ATechnique for enhancing adhesion capability of heat spreaders in molded packagesTEXAS INSTRUMENTS INC·Filed 1992·Granted Nov 8, 1994·17 cites·19 claims
- 1949US6227353B1System for applying a rotary force to strips of varying widthsTEXAS INSTRUMENTS INC·Filed 2000·Granted May 8, 2001·2 cites·4 claims
- 2045US6528873B1Ball grid assembly with solder columnsTEXAS INSTRUMENTS INC·Filed 1997·Granted Mar 4, 2003·10 cites·8 claims
- 2145US6234296B1System for positioning a carrier relative to a travel pathTEXAS INSTRUMENTS INC·Filed 2000·Granted May 22, 2001·1 cites·6 claims
- 2245US6069342AAutomated multiple lead frame strip radiant die attach material curing apparatusTEXAS INSTRUMENTS INC·Filed 1997·Granted May 30, 2000·10 cites·10 claims
- 2340US6030859AMethod of making a packaged semiconductor device and a lead-frame thereforHITACHI LTD·Filed 1997·Granted Feb 29, 2000·6 cites·27 claims
- 2439US2003027415A1Ball grid assembly with solder columnsFiled 2002·Application pending·0 cites
- 2538US6226452B1Radiant chamber for simultaneous rapid die attach and lead frame embed for ceramic packagingTEXAS INSTRUMENTS INC·Filed 1998·Granted May 1, 2001·8 cites·12 claims
- 2637US5993591ACoring of leadframes in carriers via radiant heat sourceTEXAS INSTRUMENTS INC·Filed 1997·Granted Nov 30, 1999·9 cites·22 claims
- 2732US5648299APackaged semiconductor device and a leadframe thereforHITACHI LTD·Filed 1996·Granted Jul 15, 1997·1 cites·11 claims
- 2831US6096578AStress relief matrix for integrated circuit packagingTEXAS INSTRUMENTS INC·Filed 1999·Granted Aug 1, 2000·2 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →