Inventor · disambiguated record
John I. Jones
Also filed as: JONES JOHN · JONES JOHN I
13 granted patents·1,096 citations·filing 1984–1997
95Inventor score
Files withTEXAS INSTRUMENTS INC13
Top patents by PatentIndex Score
13 records- 0197US5464499AMulti-electrode plasma processing apparatusTEXAS INSTRUMENTS INC·Filed 1993·Granted Nov 7, 1995·297 cites·11 claims
- 0297US4886570AProcessing apparatus and methodTEXAS INSTRUMENTS INC·Filed 1988·Granted Dec 12, 1989·160 cites·40 claims
- 0394US5286297AMulti-electrode plasma processing apparatusTEXAS INSTRUMENTS INC·Filed 1992·Granted Feb 15, 1994·96 cites·20 claims
- 0493US4695700ADual detector system for determining endpoint of plasma etch processTEXAS INSTRUMENTS INC·Filed 1984·Granted Sep 22, 1987·69 cites·14 claims
- 0591US4838990AMethod for plasma etching tungstenTEXAS INSTRUMENTS INC·Filed 1987·Granted Jun 13, 1989·102 cites·11 claims
- 0691US4836905AProcessing apparatusTEXAS INSTRUMENTS INC·Filed 1987·Granted Jun 6, 1989·117 cites·12 claims
- 0788US4842686AWafer processing apparatus and methodTEXAS INSTRUMENTS INC·Filed 1987·Granted Jun 27, 1989·54 cites·63 claims
- 0887US4822450AProcessing apparatus and methodTEXAS INSTRUMENTS INC·Filed 1988·Granted Apr 18, 1989·56 cites·30 claims
- 0985US4891087AIsolation substrate ring for plasma reactorTEXAS INSTRUMENTS INC·Filed 1987·Granted Jan 2, 1990·39 cites·11 claims
- 1078US4872938AProcessing apparatusTEXAS INSTRUMENTS INC·Filed 1988·Granted Oct 10, 1989·51 cites·4 claims
- 1162US4849067AMethod for etching tungstenTEXAS INSTRUMENTS INC·Filed 1987·Granted Jul 18, 1989·27 cites·2 claims
- 1253US4657618APowered load lock electrode/substrate assembly including robot arm, optimized for plasma process uniformity and rateTEXAS INSTRUMENTS INC·Filed 1984·Granted Apr 14, 1987·19 cites·28 claims
- 1336US6685073B1Method and apparatus for stretching and processing saw film tape after breaking a partially sawn waferTEXAS INSTRUMENTS INC·Filed 1997·Granted Feb 3, 2004·9 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →