Inventor · disambiguated record

Hongyan Ning

Also filed as: NING HONGYAN

8 granted patents·1 pending application·2 citations·filing 2021–2022

72Inventor score

Technology areasH05K G06F H10W

Files withSHENZHEN MICROBT ELECTRONICS TECH CO LTD9

Top patents by PatentIndex Score

9 records

0189US12178009B2Liquid-cooling heat dissipation apparatus, liquid-cooling data processing device and temperature equalization methodSHENZHEN MICROBT ELECTRONICS TECH CO LTD·Filed 2021·Granted Dec 24, 2024·2 cites·20 claims
0261US12439545B2Supercomputing serverSHENZHEN MICROBT ELECTRONICS TECH CO LTD·Filed 2021·Granted Oct 7, 2025·0 cites·14 claims
0354US12402273B2Liquid cooled electronic deviceSHENZHEN MICROBT ELECTRONICS TECH CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·9 claims
0453US11723175B2Rotary liquid distributor for liquid-cooled tank and liquid-cooled tankSHENZHEN MICROBT ELECTRONICS TECH CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·14 claims
0553US11675408B2Computing device and series power supply methodSHENZHEN MICROBT ELECTRONICS TECH CO LTD·Filed 2022·Granted Jun 13, 2023·0 cites·16 claims
0652US12141002B2Hashboard, power supply system of digital processing device, and digital processing deviceSHENZHEN MICROBT ELECTRONICS TECH CO LTD·Filed 2021·Granted Nov 12, 2024·0 cites·14 claims
0751US11956920B2Liquid-cooled plate radiatorSHENZHEN MICROBT ELECTRONICS TECH CO LTD·Filed 2021·Granted Apr 9, 2024·0 cites·8 claims
0851US11619985B2Operational circuit of virtual currency data processing device, and virtual currency data processing deviceSHENZHEN MICROBT ELECTRONICS TECH CO LTD·Filed 2021·Granted Apr 4, 2023·0 cites·9 claims
0944US2023086448A1Liquid cooling plate suitable for liquid cooling heat dissipation of electronic device, and heat dissipation unitSHENZHEN MICROBT ELECTRONICS TECH CO LTD·Filed 2021·Application pending·0 cites

Join the waitlist — get patent alerts

Get an alert when Hongyan Ning files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →