Inventor · disambiguated record
Prasanna Raghavan
Also filed as: RAGHAVAN PRASANNA
5 granted patents·2 pending applications·11 citations·filing 2005–2023
71Inventor score
Files withINTEL CORP7
Top patents by PatentIndex Score
7 records- 0184US10845552B2Coreless package architecture for multi-chip opto-electronicsINTEL CORP·Filed 2017·Granted Nov 24, 2020·4 cites·25 claims
- 0275US9633937B2Electronic assembly that includes stacked electronic devicesINTEL CORP·Filed 2014·Granted Apr 25, 2017·5 cites·15 claims
- 0369US10231338B2Methods of forming trenches in packages structures and structures formed therebyINTEL CORP·Filed 2015·Granted Mar 12, 2019·2 cites·23 claims
- 0463US12494441B2BGA stiffener attachment with low Eolife adhesive strength at high solder joint stress area generated from enabling loadINTEL CORP·Filed 2022·Granted Dec 9, 2025·0 cites·25 claims
- 0554US2024355759A1Localized damping elements for mitigating interconnect vibration damageINTEL CORP·Filed 2023·Application pending·0 cites
- 0647US11322456B2Die back side structures for warpage controlINTEL CORP·Filed 2017·Granted May 3, 2022·0 cites·20 claims
- 0739US2007152314A1Low stress stacked die packagesINTEL CORP·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Prasanna Raghavan files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →