Inventor · disambiguated record
Pak Kin Leung
Also filed as: LEUNG PAK KIN
6 granted patents·13 citations·filing 2008–2019
75Inventor score
Files withASM ASSEMBLY AUTOMATION LTD1ASM TECH SINGAPORE PTE LTD1ASMPT SINGAPORE PTE LTD1HUNG KIN YIK1LAW YI KEI1
Top patents by PatentIndex Score
6 records- 0172US7667355B2Apparatus for generating amplified cooling air flowsASM ASSEMBLY AUTOMATION LTD·Filed 2008·Granted Feb 23, 2010·7 cites·11 claims
- 0260US10622329B2Bond head cooling apparatusLAW YI KEI·Filed 2014·Granted Apr 14, 2020·2 cites·16 claims
- 0358US10312214B2Atomization mechanism for cooling a bond headASM TECH SINGAPORE PTE LTD·Filed 2016·Granted Jun 4, 2019·1 cites·18 claims
- 0456US9281290B2Bond head for thermal compression die bondingHUNG KIN YIK·Filed 2012·Granted Mar 8, 2016·2 cites·13 claims
- 0553US10192847B2Rapid cooling system for a bond head heaterMA LU·Filed 2014·Granted Jan 29, 2019·1 cites·18 claims
- 0642US11776930B2Die bond head apparatus with die holder motion tableASMPT SINGAPORE PTE LTD·Filed 2019·Granted Oct 3, 2023·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →