Inventor · disambiguated record
Marcel Giesen
Also filed as: GIESEN MARCEL
8 granted patents·2 pending applications·6 citations·filing 2012–2024
76Inventor score
Top patents by PatentIndex Score
10 records- 0175US12136912B2RF filter deviceRF360 SINGAPORE PTE LTD·Filed 2019·Granted Nov 5, 2024·2 cites·15 claims
- 0274US2025030402A1Rf filter deviceRF360 SINGAPORE PTE LTD·Filed 2024·Application pending·0 cites
- 0372US9908773B2Method for packaging a microelectronic device in a hermetically sealed cavity and managing the atmosphere of the cavity with a dedicated holeCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2013·Granted Mar 6, 2018·3 cites·14 claims
- 0458US10136226B2Top-port MEMS microphone and method of manufacturing the sameEPCOS AG·Filed 2012·Granted Nov 20, 2018·1 cites·17 claims
- 0550US12047744B2Etch stop and protection layer for capacitor processing in electroacoustic devicesRF360 SINGAPORE PTE LTD·Filed 2021·Granted Jul 23, 2024·0 cites·30 claims
- 0645US10076035B2Miniaturized multi-part component and method for producing sameSNAPTRACK INC·Filed 2014·Granted Sep 11, 2018·0 cites·17 claims
- 0744US9199839B2Method of hermetically sealing a hole with a fuse materialCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2014·Granted Dec 1, 2015·0 cites·19 claims
- 0842US9637379B2Method for producing a microelectromechanical transducerEPCOS AG·Filed 2014·Granted May 2, 2017·0 cites·18 claims
- 0941US10532924B2Packaging structure of a microelectronic device having a hermeticity improved by a diffusion barrier layerCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2013·Granted Jan 14, 2020·0 cites·9 claims
- 1041US2017144883A1Microelectronic package and method of manufacturing a microelectronic packageEPCOS AG·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →