Inventor · disambiguated record
Yun Mook Park
Also filed as: PARK YUN · PARK YUN MOOK
6 granted patents·2 pending applications·88 citations·filing 2006–2024
81Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0192US7977789B2Bump with multiple vias for semiconductor package and fabrication method thereof, and semiconductor package utilizing the sameNEPES CORP·Filed 2006·Granted Jul 12, 2011·64 cites·19 claims
- 0279US8237276B2Bump structure and fabrication method thereofSONG CHI JUNG·Filed 2010·Granted Aug 7, 2012·8 cites·6 claims
- 0377US9564411B2Semiconductor package and method of manufacturing the sameNEPES CO LTD·Filed 2012·Granted Feb 7, 2017·7 cites·12 claims
- 0468US7919833B2Semiconductor package having a crack-propagation preventing unitNEPES CORP·Filed 2008·Granted Apr 5, 2011·5 cites·7 claims
- 0564US7906842B2Wafer level system in package and fabrication method thereofNEPES CORP·Filed 2007·Granted Mar 15, 2011·4 cites·15 claims
- 0659US2024347434A1Package for semiconductorNEPES CO LTD·Filed 2024·Application pending·0 cites
- 0754US2024258157A1Wiring structure and semiconductor device comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0837US11264330B2Chip package with connection portion that passes through an encapsulation portionNEPES CO LTD·Filed 2018·Granted Mar 1, 2022·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →