Inventor · disambiguated record
Kwok Kee Chung
Also filed as: CHUNG KWOK KEE
3 granted patents·1 pending application·113 citations·filing 2006–2010
70Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0192US7854365B2Direct die attach utilizing heated bond headASM ASSEMBLY AUTOMATION LTD·Filed 2008·Granted Dec 21, 2010·102 cites·14 claims
- 0276US7810698B2Vision system for positioning a bonding toolASM ASSEMBLY AUTOMATION LTD·Filed 2008·Granted Oct 12, 2010·11 cites·15 claims
- 0331US8293043B2Automatic level adjustment for die bonderCHUNG KWOK KEE·Filed 2006·Granted Oct 23, 2012·0 cites·14 claims
- 0427US2012094440A1Method of die bonding onto dispensed adhesivesCHUNG KWOK KEE·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →