Inventor · disambiguated record
Akira Makabe
Also filed as: MAKABE AKIRA
6 granted patents·1 pending application·304 citations·filing 1999–2007
87Inventor score
Top patents by PatentIndex Score
7 records- 0194US6809020B2Method for forming bump, semiconductor device and method for making the same, circuit board, and electronic deviceSEIKO EPSON CORP·Filed 2001·Granted Oct 26, 2004·108 cites·27 claims
- 0294US6690423B1Solid-state image pickup apparatusTOSHIBA KK·Filed 1999·Granted Feb 10, 2004·142 cites·21 claims
- 0389US7579692B2Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2007·Granted Aug 25, 2009·15 cites·8 claims
- 0486US7224003B2Solid-state image pickup apparatusTOSHIBA KK·Filed 2006·Granted May 29, 2007·8 cites·9 claims
- 0579US7042061B2Solid-state image pickup apparatusTOSHIBA KK·Filed 2003·Granted May 9, 2006·20 cites·10 claims
- 0669US7355280B2Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2004·Granted Apr 8, 2008·11 cites·4 claims
- 0736US2002033531A1Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrumentFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →