Inventor · disambiguated record
Jaimal Mallory Williamson
Also filed as: WILLIAMSON JAIMAL · WILLIAMSON JAIMAL M · WILLIAMSON JAIMAL MALLORY
19 granted patents·8 pending applications·69 citations·filing 2003–2025
91Inventor score
Top patents by PatentIndex Score
27 records- 0195US11289412B2Package substrate with partially recessed capacitorTEXAS INSTRUMENTS INC·Filed 2020·Granted Mar 29, 2022·6 cites·16 claims
- 0292US11804382B2Method of forming package substrate with partially recessed capacitorTEXAS INSTRUMENTS INC·Filed 2022·Granted Oct 31, 2023·2 cites·14 claims
- 0387US9934989B1Process for forming leadframe having organic, polymerizable photo-imageable adhesion layerTEXAS INSTRUMENTS INC·Filed 2016·Granted Apr 3, 2018·6 cites·24 claims
- 0487US7079393B2Fluidic cooling systems and methods for electronic componentsIBM·Filed 2004·Granted Jul 18, 2006·44 cites·21 claims
- 0581US12278205B2Semiconductor device package with improved die pad and solder mask designTEXAS INSTRUMENTS INC·Filed 2020·Granted Apr 15, 2025·2 cites·25 claims
- 0677US10347589B2Semiconductor substrate having stress-absorbing surface layerTEXAS INSTRUMENTS INC·Filed 2017·Granted Jul 9, 2019·2 cites·13 claims
- 0772US11081406B2Via integrity and board level reliability testingTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 3, 2021·2 cites·23 claims
- 0871US9673065B2Semiconductor substrate having stress-absorbing surface layerTEXAS INSTRUMENTS INC·Filed 2014·Granted Jun 6, 2017·2 cites·6 claims
- 0971US2025323178A1Package substrate with cte matching barrier ring around microviasTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 1070US9281269B2Integrated circuit package and method of manufactureTEXAS INSTRUMENTS INC·Filed 2012·Granted Mar 8, 2016·3 cites·10 claims
- 1169US12243835B2Package substrate with CTE matching barrier ring around microviasTEXAS INSTRUMENTS INC·Filed 2022·Granted Mar 4, 2025·0 cites·19 claims
- 1265US12489075B2Enhanced mold compound thermal conductivityTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 2, 2025·0 cites·20 claims
- 1364US11973017B2Package substrate having porous dielectric layerTEXAS INSTRUMENTS INC·Filed 2021·Granted Apr 30, 2024·0 cites·13 claims
- 1462US2025201689A1Multilevel package substrate with stair shaped substrate tracesTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 1559US12266597B2Multilevel package substrate with stair shaped substrate tracesTEXAS INSTRUMENTS INC·Filed 2021·Granted Apr 1, 2025·0 cites·20 claims
- 1658US10490515B2Semiconductor substrate having stress-absorbing surface layerTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 26, 2019·0 cites·39 claims
- 1757US2025246506A1Electronic device with thermally conductive material in semiconductor die trenchTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1855US11270955B2Package substrate with CTE matching barrier ring around microviasTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 8, 2022·0 cites·34 claims
- 1954US10672692B2Leadframe having organic, polymerizable photo-imageable adhesion layerTEXAS INSTRUMENTS INC·Filed 2017·Granted Jun 2, 2020·0 cites·30 claims
- 2054US2025006660A1Metal filling and top metal spacing for die crack mitigationTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2153US2024178154A1Electronic device package emi shielding with grounded mold interconnectTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2252US12199008B2Package heat dissipation including a die attach filmTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 14, 2025·0 cites·11 claims
- 2349US2025273535A1Electronic device dual side molded soldermaskless package substrate package for improved thermal dissipation and thermomechanical integrityTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2448US2008076690A1Non-hermetic encapsulant removal for module reworkIBM·Filed 2007·Application pending·0 cites
- 2543US10748863B2Semiconductor devices having metal posts for stress relief at flatness discontinuitiesTEXAS INSTRUMENTS INC·Filed 2017·Granted Aug 18, 2020·0 cites·21 claims
- 2639US2005066995A1Non-hermetic encapsulant removal for module reworkIBM·Filed 2003·Application pending·0 cites
- 2737US8674504B2Wire-based methodology of widening the pitch of semiconductor chip terminalsODEGARD CHARLES ANTHONY·Filed 2012·Granted Mar 18, 2014·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →