Inventor · disambiguated record
Yong She
Also filed as: SHE YONG
24 granted patents·4 pending applications·40 citations·filing 2005–2022
93Inventor score
Top patents by PatentIndex Score
28 records- 0194US10910347B2Method, apparatus and system to interconnect packaged integrated circuit diesINTEL CORP·Filed 2019·Granted Feb 2, 2021·10 cites·22 claims
- 0290US10991679B2Stair-stacked dice device in a system in package, and methods of making sameINTEL CORP·Filed 2020·Granted Apr 27, 2021·2 cites·20 claims
- 0389US10930622B2Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making sameINTEL CORP·Filed 2020·Granted Feb 23, 2021·2 cites·21 claims
- 0483US9859255B1Electronic device packageINTEL CORP·Filed 2016·Granted Jan 2, 2018·6 cites·23 claims
- 0580US9778688B2Flexible system-in-package solutions for wearable devicesINTEL CORP·Filed 2014·Granted Oct 3, 2017·5 cites·24 claims
- 0679US10332899B23D package having edge-aligned die stack with direct inter-die wire connectionsINTEL CORP·Filed 2017·Granted Jun 25, 2019·3 cites·11 claims
- 0778US11538746B2Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making sameINTEL CORP·Filed 2016·Granted Dec 27, 2022·3 cites·17 claims
- 0878US10770434B2Stair-stacked dice device in a system in package, and methods of making sameINTEL CORP·Filed 2016·Granted Sep 8, 2020·2 cites·21 claims
- 0978US10727208B2Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making sameINTEL CORP·Filed 2016·Granted Jul 28, 2020·2 cites·25 claims
- 1076US11081451B2Die stack with reduced warpageINTEL CORP·Filed 2017·Granted Aug 3, 2021·2 cites·23 claims
- 1175US10396055B2Method, apparatus and system to interconnect packaged integrated circuit diesINTEL CORP·Filed 2015·Granted Aug 27, 2019·2 cites·24 claims
- 1272US11894344B2Power enhanced stacked chip scale package solution with integrated die attach filmINTEL CORP·Filed 2022·Granted Feb 6, 2024·0 cites·19 claims
- 1370US12046581B2Integrated circuit package with glass spacerINTEL CORP·Filed 2022·Granted Jul 23, 2024·0 cites·20 claims
- 1467US11848281B2Die stack with reduced warpageINTEL CORP·Filed 2021·Granted Dec 19, 2023·0 cites·18 claims
- 1564US10438916B2Wire bond connection with intermediate contact structureINTEL CORP·Filed 2016·Granted Oct 8, 2019·1 cites·20 claims
- 1655US11302671B2Power enhanced stacked chip scale package solution with integrated die attach filmINTEL CORP·Filed 2017·Granted Apr 12, 2022·0 cites·20 claims
- 1752US12027496B2Film in substrate for releasing z stack-up constraintINTEL CORP·Filed 2019·Granted Jul 2, 2024·0 cites·25 claims
- 1852US11393788B2Integrated circuit package with glass spacerINTEL CORP·Filed 2016·Granted Jul 19, 2022·0 cites·12 claims
- 1948US11990395B2Joint connection of corner non-critical to function (NCTF) ball for BGA solder joint reliability (SJR) enhancementINTEL CORP·Filed 2019·Granted May 21, 2024·0 cites·25 claims
- 2047US11742284B2Interconnect structure fabricated using lithographic and deposition processesINTEL CORP·Filed 2018·Granted Aug 29, 2023·0 cites·22 claims
- 2146US12512360B2Chip transfer method and electronic deviceHUAWEI TECH CO LTD·Filed 2021·Granted Dec 30, 2025·0 cites·20 claims
- 2244US2023178442A1Package structure and electronic apparatusHUAWEI TECH CO LTD·Filed 2020·Application pending·0 cites
- 2341US11830848B2Electronic device packageINTEL CORP·Filed 2016·Granted Nov 28, 2023·0 cites·15 claims
- 2437US2006275569A1Thermoplastic molding material for electronic packagingMISHRA SANJAY B·Filed 2005·Application pending·0 cites
- 2536US2019355700A1Techniques for windowed substrate integrated circuit packagesINTEL CORP·Filed 2016·Application pending·0 cites
- 2636US2018096946A1Semiconductor packages having a fiducial marker and methods for aligning tools relative to the fiducial markerINTEL CORP·Filed 2016·Application pending·0 cites
- 2733US10872832B2Pre-molded active IC of passive components to miniaturize system in packageINTEL CORP·Filed 2015·Granted Dec 22, 2020·0 cites·19 claims
- 2832US11881441B2Stacked die semiconductor package spacer dieINTEL CORP·Filed 2017·Granted Jan 23, 2024·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →