Inventor · disambiguated record
Kuang Hann Lin
Also filed as: LIN KUANG HANN
9 granted patents·46 citations·filing 1995–2012
85Inventor score
Files withCHIANG WAN-LAN3VISHAY GEN SEMICONDUCTOR LLC2GEN INSTRUMENT CORP1GEN SEMICONDUCTOR INC1GEN SEMICONDUCTOR OF TAIWAN LT1
Top patents by PatentIndex Score
9 records- 0181US7838985B2Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layersVISHAY GEN SEMICONDUCTOR LLC·Filed 2007·Granted Nov 23, 2010·9 cites·6 claims
- 0272US8138597B2Semiconductor assembly that includes a power semiconductor die located in a cell defined by a patterned polymer layerCHIANG WAN-LAN·Filed 2010·Granted Mar 20, 2012·3 cites·11 claims
- 0371US7915728B2Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereofVISHAY GEN SEMICONDUCTOR LLC·Filed 2007·Granted Mar 29, 2011·5 cites·5 claims
- 0458US5698242AApparatus for the injection molding of semiconductor elementsGEN INSTRUMENT CORP·Filed 1995·Granted Dec 16, 1997·19 cites·5 claims
- 0548US8796840B2Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layersCHIANG WAN-LAN·Filed 2012·Granted Aug 5, 2014·0 cites·9 claims
- 0646US6576985B2Semiconductor device packaging assemblyGEN SEMICONDUCTOR TAIWAN LTD·Filed 2001·Granted Jun 10, 2003·4 cites·7 claims
- 0742US8252633B2Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereofCHIANG WAN-LAN·Filed 2011·Granted Aug 28, 2012·0 cites·10 claims
- 0839US6927094B2Method for assembling a semiconductor chip utilizing conducting bars rather than bonding wiresGEN SEMICONDUCTOR OF TAIWAN LT·Filed 2003·Granted Aug 9, 2005·0 cites·8 claims
- 0935US6068809AMethod of injection molding elements such as semiconductor elementsGEN SEMICONDUCTOR INC·Filed 1997·Granted May 30, 2000·6 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →