Inventor · disambiguated record
Dong You Kim
Also filed as: KIM DONG YOU
10 granted patents·2 pending applications·265 citations·filing 1996–2012
90Inventor score
Top patents by PatentIndex Score
12 records- 0194US8823158B2Semiconductor package and stacked semiconductor package having the sameSK HYNIX INC·Filed 2012·Granted Sep 2, 2014·27 cites·6 claims
- 0290US6118174ABottom lead frame and bottom lead semiconductor package using the sameLG SEMICON CO LTD·Filed 1997·Granted Sep 12, 2000·139 cites·26 claims
- 0381US8299591B2Semiconductor package and stacked semiconductor package having the sameOH JAE SUNG·Filed 2008·Granted Oct 30, 2012·10 cites·4 claims
- 0463US8110751B2Semiconductor memory module and electronic component socket for coupling with the sameKIM DONG YOU·Filed 2009·Granted Feb 7, 2012·7 cites·7 claims
- 0563US7291906B2Stack package and fabricating method thereofCHA KI BON·Filed 2003·Granted Nov 6, 2007·16 cites·13 claims
- 0660US5926380ALead frame lattice and integrated package fabrication method applied theretoLG SEMICON CO LTD·Filed 1997·Granted Jul 20, 1999·26 cites·17 claims
- 0758US5748450ABGA package using a dummy ball and a repairing method thereofLG SEMICON CO LTD·Filed 1996·Granted May 5, 1998·24 cites·18 claims
- 0847US8445166B2Fabrication method of lithography mask and formation method of fine pattern using the sameSONG HO YOUNG·Filed 2008·Granted May 21, 2013·0 cites·13 claims
- 0942US6010058ABGA package using a dummy ball and a repairing method thereofLG SEMICON CO LTD·Filed 1998·Granted Jan 4, 2000·9 cites·13 claims
- 1037US5939776ALead frame structure having non-removable dam bars for semiconductor packageLG SEMICON CO LTD·Filed 1997·Granted Aug 17, 1999·7 cites·19 claims
- 1135US2008203552A1Stacked Package and Method of Fabricating the SameUNISEMICON CO LTD·Filed 2005·Application pending·0 cites
- 1228US2001045632A1Semiconductor chip package and fabrication method thereforHYUNDAI ELECTRONICS IND·Filed 1998·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Dong You Kim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →