Inventor · disambiguated record
Shimpei Tsujikawa
Also filed as: TSUJIKAWA SHIMPEI
20 granted patents·4 pending applications·64 citations·filing 2000–2025
93Inventor score
Top patents by PatentIndex Score
24 records- 0193US11765923B2Light emitting element, method for manufacturing the same, and display deviceSONY GROUP CORP·Filed 2021·Granted Sep 19, 2023·2 cites·11 claims
- 0287US12245449B2Light emitting element, method for manufacturing the same, and display deviceSONY GROUP CORP·Filed 2024·Granted Mar 4, 2025·0 cites·10 claims
- 0383US12069880B2Light emitting element, method for manufacturing the same, and display deviceSONY GROUP CORP·Filed 2023·Granted Aug 20, 2024·0 cites·12 claims
- 0482US6656804B2Semiconductor device and production method thereofHITACHI LTD·Filed 2001·Granted Dec 2, 2003·26 cites·3 claims
- 0581US2025268048A1Light emitting element, method for manufacturing the same, and display deviceSONY GROUP CORP·Filed 2025·Application pending·0 cites
- 0679US10326096B2Light emitting element, method for manufacturing the same, and display deviceSONY CORP·Filed 2016·Granted Jun 18, 2019·2 cites·16 claims
- 0775US9214496B2Transistor, display, and electric apparatusSONY CORP·Filed 2015·Granted Dec 15, 2015·2 cites·12 claims
- 0869US6417052B1Fabrication process for semiconductor deviceHITACHI LTD·Filed 2000·Granted Jul 9, 2002·14 cites·6 claims
- 0968US8981375B2Transistor, display, and electronic apparatusSONY CORP·Filed 2012·Granted Mar 17, 2015·2 cites·6 claims
- 1068US7863125B2Manufacturing method of CMOS type semiconductor device, and CMOS type semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Jan 4, 2011·3 cites·7 claims
- 1166US11024823B2Light emitting element, method for manufacturing the same, and display deviceSONY CORP·Filed 2019·Granted Jun 1, 2021·0 cites·12 claims
- 1264US7196384B2Semiconductor device and method for manufacturing thereofHITACHI ULSI SYS CO LTD·Filed 2005·Granted Mar 27, 2007·1 cites·2 claims
- 1363US7432216B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2006·Granted Oct 7, 2008·2 cites·11 claims
- 1460US9899385B2Semiconductor integrated circuit and manufacturing method thereofYAMAZAKI TAKASHI·Filed 2012·Granted Feb 20, 2018·1 cites·12 claims
- 1555US6897104B2Semiconductor device and method for manufacturing thereofHITACHI ULSI SYS CO LTD·Filed 2003·Granted May 24, 2005·3 cites·5 claims
- 1649US6777296B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2002·Granted Aug 17, 2004·2 cites·4 claims
- 1746US7569890B2Manufacturing method of CMOS type semiconductor device, and CMOS type semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Aug 4, 2009·0 cites·4 claims
- 1846US7112833B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2004·Granted Sep 26, 2006·2 cites·4 claims
- 1946US6849513B2Semiconductor device and production method thereofRENESAS TECH CORP·Filed 2003·Granted Feb 1, 2005·2 cites·3 claims
- 2045US11100857B2Display device and electronic apparatusSONY CORP·Filed 2017·Granted Aug 24, 2021·0 cites·18 claims
- 2145US6982468B2Semiconductor device and method for manufacturing thereofHITACHI ULSI SYS CO LTD·Filed 2004·Granted Jan 3, 2006·0 cites·1 claims
- 2241US2013148243A1Esd protecting circuit and semiconductor device including the sameSONY CORP·Filed 2012·Application pending·0 cites
- 2338US2011031981A1Valuation method of dielectric breakdown lifetime of gate insulating film, valuation device of dielectric breakdown lifetime of gate insulating film and program for evaluating dielectric breakdown lifetime of gate insulating filmSONY CORP·Filed 2010·Application pending·0 cites
- 2435US2001019158A1Semiconductor device having gate insulating film of silicon oxide and silicon nitride filmsFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →