Inventor · disambiguated record
Dae-Lok Bae
Also filed as: BAE DAE-LOK
22 granted patents·6 pending applications·618 citations·filing 1998–2013
95Inventor score
Top patents by PatentIndex Score
28 records- 0199US8343851B2Wafer temporary bonding method using silicon direct bondingSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jan 1, 2013·239 cites·16 claims
- 0298US8354308B2Conductive layer buried-type substrate, method of forming the conductive layer buried-type substrate, and method of fabricating semiconductor device using the conductive layer buried-type substrateSAMSUNG ELECTRONICS CO LTD·Filed 2011·Granted Jan 15, 2013·230 cites·13 claims
- 0394US8390120B2Semiconductor device and method of fabricating the sameMOON KWANG-JIN·Filed 2010·Granted Mar 5, 2013·29 cites·29 claims
- 0493US8791405B2Optical waveguide and coupler apparatus and method of manufacturing the sameJI HO-CHUL·Filed 2010·Granted Jul 29, 2014·21 cites·20 claims
- 0593US8570409B2Image sensors and methods of manufacturing image sensorsCHOI SANG-JUN·Filed 2010·Granted Oct 29, 2013·17 cites·10 claims
- 0689US8129833B2Stacked integrated circuit packages that include monolithic conductive viasKANG PIL-KYU·Filed 2009·Granted Mar 6, 2012·13 cites·10 claims
- 0784US8873901B2Buried-type optical input/output devices and methods of manufacturing the sameKANG PIL-KYU·Filed 2012·Granted Oct 28, 2014·6 cites·20 claims
- 0881US9103974B2Semiconductor devices having optical transceiverKANG PIL-KYU·Filed 2012·Granted Aug 11, 2015·5 cites·13 claims
- 0979US8422845B2Optical input/output device for photo-electric integrated circuit device and method of fabricating sameKANG PIL-KYU·Filed 2010·Granted Apr 16, 2013·4 cites·8 claims
- 1077US8319329B2Stacked integrated circuit package having recessed sidewallsKANG PIL-KYU·Filed 2012·Granted Nov 27, 2012·3 cites·18 claims
- 1167US9530726B2Semiconductor device and method of fabricating the sameMOON KWANG-JIN·Filed 2013·Granted Dec 27, 2016·2 cites·16 claims
- 1266US6437445B1Niobium-near noble metal contact structures for integrated circuitsSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Aug 20, 2002·10 cites·8 claims
- 1366US6150249AMethods of forming niobium-near noble metal contact structures for integrated circuitsSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Nov 21, 2000·30 cites·10 claims
- 1465US7781302B2Methods of fabricating semiconductor devices having isolation regions formed from annealed oxygen ion implanted regionsSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 24, 2010·3 cites·17 claims
- 1565US7605022B2Methods of manufacturing a three-dimensional semiconductor device and semiconductor devices fabricated therebySAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 20, 2009·4 cites·26 claims
- 1664US8867882B2Optical input/output device for photo-electric integrated circuit device and method of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 21, 2014·1 cites·15 claims
- 1763US9831164B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 28, 2017·1 cites·15 claims
- 1852US8958002B2Image sensorsSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 17, 2015·0 cites·16 claims
- 1952US2013049225A1Stacked integrated circuit packages that include monolithic conductive viasSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 2048US7932163B2Methods of forming stacked semiconductor devices with single-crystal semiconductor regionsSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Apr 26, 2011·0 cites·17 claims
- 2147US2009221133A1Methods of Fabricating Silicon on Insulator (SOI) WafersSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 2246US2008213982A1Method of fabricating semiconductor waferSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2345US2008124930A1Methods of recycling a substrate including using a chemical mechanical polishing processSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2443US8735265B2Methods of selectively forming silicon-on-insulator structures using selective expitaxial growth processKANG PIL-KYU·Filed 2011·Granted May 27, 2014·0 cites·8 claims
- 2543US8546162B2Method for forming light guide layer in semiconductor substrateBAE DAE-LOK·Filed 2011·Granted Oct 1, 2013·0 cites·20 claims
- 2640US8324055B2Methods of manufacturing buried wiring type substrate and semiconductor device incorporating buried wiring type substrateKANG PIL-KYU·Filed 2011·Granted Dec 4, 2012·0 cites·8 claims
- 2738US2012132986A1Semiconductor devices and methods of manufacturing the sameKANG PIL-KYU·Filed 2011·Application pending·0 cites
- 2833US2012108034A1Substrate Structure Having Buried Wiring And Method For Manufacturing The Same, And Semiconductor Device And Method For Manufacturing The Same Using The Substrate StructureBAE DAE-LOK·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →