Inventor · disambiguated record
Woon-Bae Kim
Also filed as: KIM WOON BAE
84 granted patents·16 pending applications·718 citations·filing 1993–2023
99Inventor score
Top patents by PatentIndex Score
100 records- 0197US7285865B2Micro-package, multi-stack micro-package, and manufacturing method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Oct 23, 2007·57 cites·23 claims
- 0294US7923793B2Image sensor module and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Apr 12, 2011·32 cites·23 claims
- 0394US7580195B2Optical lens and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 25, 2009·38 cites·58 claims
- 0492US8149512B2Micro-shutter device and method of manufacturing the sameKIM WOON-BAE·Filed 2009·Granted Apr 3, 2012·15 cites·12 claims
- 0592US7667946B2Tunable capacitor using electrowetting phenomenonSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 23, 2010·19 cites·15 claims
- 0691US7719167B2Electroactive polymer actuator and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 18, 2010·22 cites·21 claims
- 0791US7408434B2Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 5, 2008·17 cites·8 claims
- 0890US7589422B2Micro-element package having a dual-thickness substrate and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 15, 2009·19 cites·5 claims
- 0990US7417525B2High efficiency inductor, method for manufacturing the inductor, and packaging structure using the inductorSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 26, 2008·18 cites·16 claims
- 1090US7374972B2Micro-package, multi-stack micro-package, and manufacturing method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 20, 2008·18 cites·15 claims
- 1190US6633513B1Magneto-optical head for magneto-optical reading and writing systemSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Oct 14, 2003·40 cites·25 claims
- 1287US9445063B2Fiber scanning projectorSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Sep 13, 2016·6 cites·19 claims
- 1387US8061910B2Micro shutter having iris function, method for manufacturing the same, and micro camera module having the sameKIM CHE-HEUNG·Filed 2008·Granted Nov 22, 2011·9 cites·27 claims
- 1487US7786573B2Packaging chip having interconnection electrodes directly connected to plural wafersSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 31, 2010·16 cites·6 claims
- 1587US7663083B2Image sensor module having electric component and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 16, 2010·16 cites·19 claims
- 1687US7545017B2Wafer level package for surface acoustic wave device and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 9, 2009·10 cites·11 claims
- 1787US7065867B2Low temperature hermetic sealing method having passivation layerSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jun 27, 2006·34 cites·10 claims
- 1886US9870100B2Multi-touch sensing apparatus using rear view camera of array typeSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 16, 2018·4 cites·5 claims
- 1986US8531580B2Imaging device including a plurality of imaging unitsCHOI MIN-SEOG·Filed 2011·Granted Sep 10, 2013·7 cites·26 claims
- 2086US8147150B2Micro shutter having iris function, method for manufacturing the same, and micro camera module having the sameKIM CHE-HEUNG·Filed 2011·Granted Apr 3, 2012·5 cites·18 claims
- 2186US7794799B1Process for producing array plate for biomolecules having hydrophilic and hydrophobic regionsSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Sep 14, 2010·61 cites·40 claims
- 2286US7755151B2Wafer level package for surface acoustic wave device and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jul 13, 2010·15 cites·11 claims
- 2384US8654177B2Flexible image photographing apparatus with a plurality of image forming units and method for manufacturing the sameKIM WOON-BAE·Filed 2009·Granted Feb 18, 2014·8 cites·23 claims
- 2484US7619837B2Varifocal optical deviceSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Nov 17, 2009·12 cites·12 claims
- 2584US7449366B2Wafer level packaging cap and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 11, 2008·12 cites·18 claims
- 2683US11107743B2Chip on film package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 31, 2021·3 cites·16 claims
- 2783US7986466B2Varifocal lensSAMSUNG ELECTRO MECH·Filed 2008·Granted Jul 26, 2011·11 cites·20 claims
- 2883US7408257B2Packaging chip and packaging method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 5, 2008·11 cites·13 claims
- 2982US8111464B2Optical lens and manufacturing method thereofLEE JEONG-YUB·Filed 2008·Granted Feb 7, 2012·11 cites·35 claims
- 3082US6969639B2Wafer level hermetic sealing methodSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Nov 29, 2005·28 cites·28 claims
- 3181US9151945B2Micro electric liquid device and apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 6, 2015·4 cites·20 claims
- 3280US7605404B2Image pickup device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 20, 2009·5 cites·21 claims
- 3380US7528481B2Wafer level packaging cap and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 5, 2009·7 cites·6 claims
- 3479US10354967B2Metal pillar in a film-type semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 16, 2019·3 cites·17 claims
- 3579US7335974B2Multi stack packaging chip and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 26, 2008·8 cites·16 claims
- 3678US10134667B2Chip-on-film semiconductor packages and display apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 20, 2018·2 cites·20 claims
- 3778US9098146B2Multi-touch sensing apparatus using rear view camera of array typeYI KWON JU·Filed 2010·Granted Aug 4, 2015·4 cites·7 claims
- 3877US9978674B2Chip-on-film semiconductor packages and display apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 22, 2018·2 cites·9 claims
- 3976US7626258B2Cap wafer, semiconductor chip having the same, and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2007·Granted Dec 1, 2009·6 cites·9 claims
- 4074US9405045B2Optical apparatusLEE JEONG-YUB·Filed 2011·Granted Aug 2, 2016·3 cites·15 claims
- 4174US8045318B2Tunable capacitor using electrowetting phenomenonSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Oct 25, 2011·3 cites·19 claims
- 4274US7456709B2Bulk acoustic resonator including a resonance part with dimple and fabrication method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 25, 2008·7 cites·5 claims
- 4373US7963021B2Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jun 21, 2011·4 cites·2 claims
- 4472US8587561B2Multi-sensing touch panel and display apparatus using the sameKIM WOON-BAE·Filed 2010·Granted Nov 19, 2013·3 cites·23 claims
- 4569US8313197B2Pattern projecting apparatus, three dimensional imaging apparatus having the same, and varifocal liquid lens being used in the sameLEE JEONG-YUB·Filed 2009·Granted Nov 20, 2012·5 cites·7 claims
- 4669US7579685B2Wafer level packaging cap and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 25, 2009·2 cites·8 claims
- 4769US6906845B2Micro-mechanical device having anti-stiction layer and method of manufacturing the deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jun 14, 2005·21 cites·8 claims
- 4868US11222853B2Integrated circuit chip, integrated circuit package and display apparatus including the integrated circuit chipSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 11, 2022·1 cites·12 claims
- 4968US8300317B2Varifocal lensLEE JEONG-YUB·Filed 2009·Granted Oct 30, 2012·4 cites·24 claims
- 5068US7906841B2Wafer level incapsulation chip and encapsulation chip manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 15, 2011·4 cites·5 claims
Showing the top 50 of 100 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →