Inventor · disambiguated record
Connie Tangpuz
Also filed as: TANGPUZ CONNIE · TANGPUZ CONNIE N
3 granted patents·1 pending application·148 citations·filing 2000–2007
77Inventor score
Top patents by PatentIndex Score
4 records- 0196US7256479B2Method to manufacture a universal footprint for a package with exposed chipFAIRCHILD SEMICONDUCTOR·Filed 2005·Granted Aug 14, 2007·62 cites·17 claims
- 0290US6661082B1Flip chip substrate designFAIRCHILD SEMICONDUCTOR·Filed 2000·Granted Dec 9, 2003·71 cites·8 claims
- 0369US7101734B2Flip chip substrate designFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Sep 5, 2006·15 cites·12 claims
- 0442US2009057855A1Semiconductor die package including stand off structuresQUINONES MARIA CLEMENS·Filed 2007·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Connie Tangpuz files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →