Inventor · disambiguated record
Richard A. Wachnik
Also filed as: WACHNIK RICHARD A · WACHNIK RICHARD ANDRE
20 granted patents·2 pending applications·649 citations·filing 1996–2023
96Inventor score
Top patents by PatentIndex Score
22 records- 0196US6069068ASub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivityIBM·Filed 1997·Granted May 30, 2000·224 cites·12 claims
- 0292US7217978B2SRAM memories and microprocessors having logic portions implemented in high-performance silicon substrates and SRAM array portions having field effect transistors with linked bodies and method for making sameIBM·Filed 2005·Granted May 15, 2007·26 cites·51 claims
- 0389US6417572B1Process for producing metal interconnections and product produced therebyIBM·Filed 1999·Granted Jul 9, 2002·105 cites·21 claims
- 0488US9773717B1Integrated circuits with peltier cooling provided by back-end wiringGLOBALFOUNDRIES INC·Filed 2016·Granted Sep 26, 2017·6 cites·18 claims
- 0588US9240406B2Precision trench capacitorGLOBALFOUNDRIES INC·Filed 2014·Granted Jan 19, 2016·9 cites·20 claims
- 0688US8338292B2Body contacts for FET in SOI SRAM arrayTAN YUE·Filed 2010·Granted Dec 25, 2012·11 cites·11 claims
- 0785US10103083B2Integrated circuits with Peltier cooling provided by back-end wiringGLOBALFOUNDRIES INC·Filed 2017·Granted Oct 16, 2018·4 cites·20 claims
- 0884US6202191B1Electromigration resistant power distribution networkIBM·Filed 1999·Granted Mar 13, 2001·83 cites·46 claims
- 0982US7224063B2Dual-damascene metallization interconnectionIBM·Filed 2001·Granted May 29, 2007·30 cites·6 claims
- 1080US6518670B1Electrically porous on-chip decoupling/shielding layerIBM·Filed 2002·Granted Feb 11, 2003·29 cites·20 claims
- 1178US8020138B2Voltage island performance/leakage screen monitor for IP characterizationIBM·Filed 2008·Granted Sep 13, 2011·9 cites·8 claims
- 1278US7470613B2Dual damascene multi-level metallizationIBM·Filed 2007·Granted Dec 30, 2008·7 cites·19 claims
- 1373US6258710B1Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivityIBM·Filed 1999·Granted Jul 10, 2001·39 cites·9 claims
- 1472US6531759B2Alpha particle shield for integrated circuitIBM·Filed 2001·Granted Mar 11, 2003·19 cites·6 claims
- 1567US7260810B2Method of extracting properties of back end of line (BEOL) chip architectureIBM·Filed 2003·Granted Aug 21, 2007·13 cites·32 claims
- 1665US6069051AMethod of producing planar metal-to-metal capacitor for use in integrated circuitsIBM·Filed 1996·Granted May 30, 2000·34 cites·17 claims
- 1760US2025077888A1Predicting local layout effects using a variational autoencoder with integrated regression and classification networkIBM·Filed 2023·Application pending·0 cites
- 1857US7989922B2Highly tunable metal-on-semiconductor trench varactorIBM·Filed 2008·Granted Aug 2, 2011·1 cites·14 claims
- 1955US11663391B2Latch-up avoidance for sea-of-gatesIBM·Filed 2021·Granted May 30, 2023·0 cites·17 claims
- 2053US2024162895A1Competing path ring-oscillator for direct measurement of a latch timing window parametersIBM·Filed 2022·Application pending·0 cites
- 2150US8809187B2Body contacts for FET in SOI SRAM arrayTAN YUE·Filed 2012·Granted Aug 19, 2014·0 cites·7 claims
- 2247US9484246B2Buried signal transmission lineGLOBALFOUNDRIES INC·Filed 2014·Granted Nov 1, 2016·0 cites·10 claims
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