Inventor · disambiguated record
Chikaomi Mori
Also filed as: MORI CHIKAOMI
12 granted patents·5 pending applications·93 citations·filing 2003–2022
88Inventor score
Files withJAPAN ELECTRONIC MATERIALS5JAPAN ELECTRONIC MAT CORPORATION4NIHON DENSHIZAIRYO KK3MORI CHIKAOMI1SHINKO ELECTRIC IND CO1
Top patents by PatentIndex Score
17 records- 0184US7307435B2Probe cardNIHON DENSHIZAIRYO KK·Filed 2005·Granted Dec 11, 2007·10 cites·5 claims
- 0284US6967493B2Probe card and contactor of the sameJAPAN ELECTRONIC MATERIALS·Filed 2004·Granted Nov 22, 2005·35 cites·14 claims
- 0383US7075319B2Probe card having a coil spring interposed between a support member and a contactor unitNIHON DENSHIZAIRYO KK·Filed 2003·Granted Jul 11, 2006·29 cites·7 claims
- 0476US7106080B2Probe card and contactor of the sameJAPAN ELECTRONIC MATERIALS·Filed 2005·Granted Sep 12, 2006·6 cites·8 claims
- 0558US10908180B2Probe card case and probe card transfer methodJAPAN ELECTRONIC MATERIALS·Filed 2017·Granted Feb 2, 2021·0 cites·9 claims
- 0658US7081766B2Probe card for examining semiconductor devices on semiconductor wafersJAPAN ELECTRONIC MATERIALS·Filed 2004·Granted Jul 25, 2006·9 cites·18 claims
- 0755US12332278B2Probe cardJAPAN ELECTRONIC MAT CORPORATION·Filed 2020·Granted Jun 17, 2025·0 cites·3 claims
- 0854US10184954B2Probe card case and probe card transfer methodJAPAN ELECTRONIC MATERIALS·Filed 2013·Granted Jan 22, 2019·0 cites·6 claims
- 0953US10139430B2Probe guide, probe card, and method for probe guide manufacturingJAPAN ELECTRONIC MAT CORPORATION·Filed 2017·Granted Nov 27, 2018·0 cites·7 claims
- 1049US2025189559A1Probe, probe card, and probe manufacturing methodJAPAN ELECTRONIC MAT CORPORATION·Filed 2022·Application pending·0 cites
- 1148US2025027973A1Probe cardJAPAN ELECTRONIC MAT CORPORATION·Filed 2021·Application pending·0 cites
- 1246US2011291685A1ProbeMORI CHIKAOMI·Filed 2009·Application pending·0 cites
- 1343US10261110B2Probe guide plate having a silicon oxide layer formed on surfaces and on an inner wall of a through hole thereof, and a protective insulating layer formed on the silicon oxide layer, and probe apparatus including the probe guide plateSHINKO ELECTRIC IND CO·Filed 2016·Granted Apr 16, 2019·0 cites·9 claims
- 1435USD751555SProbe card caseTOKYO ELECTRON LTD·Filed 2013·Granted Mar 15, 2016·2 cites·1 claims
- 1535US2003234657A1Method for producing a probe, mask for producing the probe, and probeFiled 2003·Application pending·0 cites
- 1633US6836024B2Apparatus for connecting between substratesNIHON DENSHIZAIRYO KK·Filed 2003·Granted Dec 28, 2004·2 cites·8 claims
- 1727US2005093559A1Connection pinFiled 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chikaomi Mori files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →