Inventor · disambiguated record
Byung Chul Kang
Also filed as: KANG BYUNG-CHUL
6 granted patents·3 pending applications·17 citations·filing 2003–2018
73Inventor score
Top patents by PatentIndex Score
9 records- 0172US7896051B2Semiconductor die bonding apparatus having multiple bonding head unitsHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Mar 1, 2011·12 cites·16 claims
- 0268US9153464B2Substrate processing apparatus and substrate processing methodKANG BYUNG CHUL·Filed 2012·Granted Oct 6, 2015·4 cites·15 claims
- 0350US8673110B2Solution supplying unit and substrate treating apparatus having the samePARK GUI-SU·Filed 2011·Granted Mar 18, 2014·1 cites·11 claims
- 0446US10942446B2Mask cleaning apparatus and method for cleaning maskSEMES CO LTD·Filed 2018·Granted Mar 9, 2021·0 cites·4 claims
- 0542US2006230793A1Method for manufacturing an optical fiber preform by mcvdHONG CHOON-KEUN·Filed 2003·Application pending·0 cites
- 0637US2013284367A1Substrate processing apparatus and method of supplying processing solutionSEMES CO LTD·Filed 2013·Application pending·0 cites
- 0731US2017352642A1Apparatus for bonding a semiconductor chip and method of forming a semiconductor deviceSK HYNIX INC·Filed 2016·Application pending·0 cites
- 0829US9892939B2Substrate treating apparatus and chemical recycling methodSEMES CO LTD·Filed 2012·Granted Feb 13, 2018·0 cites·22 claims
- 0929US9349626B2Buffer units, substrate processing apparatuses, and substrate processing methodsCHOI KIHOON·Filed 2012·Granted May 24, 2016·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →