Inventor · disambiguated record
Michael J. Bettinger
Also filed as: BETTINGER MICHAEL · BETTINGER MICHAEL J
24 granted patents·723 citations·filing 1992–2008
97Inventor score
Files withMICRON TECHNOLOGY INC24
Top patents by PatentIndex Score
24 records- 0197US7677429B2Concave face wire bond capillary and methodMICRON TECHNOLOGY INC·Filed 2008·Granted Mar 16, 2010·103 cites·9 claims
- 0297US7416107B2Concave face wire bond capillary and methodMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 26, 2008·102 cites·4 claims
- 0397US6158647AConcave face wire bond capillaryMICRON TECHNOLOGY INC·Filed 1998·Granted Dec 12, 2000·162 cites·7 claims
- 0495US6439450B1Concave face wire bond capillaryMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 27, 2002·119 cites·5 claims
- 0581US6311890B1Concave face wire bond capillaryMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 6, 2001·17 cites·7 claims
- 0681US5315255ANon-contact, electrostatic, discharge detectorMICRON TECHNOLOGY INC·Filed 1992·Granted May 24, 1994·45 cites·9 claims
- 0778US6966480B2Concave face wire bond capillary and methodMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 22, 2005·13 cites·4 claims
- 0878US6655535B2Methods for facilitating circuit board processingMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 2, 2003·13 cites·25 claims
- 0974US6199743B1Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assembliesMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 13, 2001·37 cites·6 claims
- 1072US5911329AApparatus and method for facilitating circuit board processingMICRON TECHNOLOGY INC·Filed 1996·Granted Jun 15, 1999·25 cites·19 claims
- 1164US6595406B2Concave face wire bond capillary and methodMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 22, 2003·12 cites·4 claims
- 1263US6279758B1Apparatus and method for facilitating circuit board processingMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 28, 2001·10 cites·17 claims
- 1360US5988619AApparatus and method for facilitating circuit board processingMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 23, 1999·12 cites·16 claims
- 1459US6357275B1Apparatus and method for providing mechanically pre-formed conductive leadsMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 19, 2002·5 cites·9 claims
- 1558US6398043B1Apparatus and method for facilitating circuit board processingMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 4, 2002·8 cites·31 claims
- 1657US5992649AApparatus and method for facilitating circuit board processingMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 30, 1999·10 cites·22 claims
- 1755US6454153B2Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assembliesMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 24, 2002·5 cites·20 claims
- 1855US6158595AApparatus and method for facilitating circuit board processingMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 12, 2000·11 cites·28 claims
- 1953US6509205B2Apparatus and method for providing mechanically pre-formed conductive leadsMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 21, 2003·3 cites·20 claims
- 2044US6474532B2Apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assembliesMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 5, 2002·1 cites·25 claims
- 2139US6504257B1Apparatus and method for providing mechanically pre-formed conductive leadsMICRON TECHNOLOGY INC·Filed 2000·Granted Jan 7, 2003·0 cites·20 claims
- 2238US5644279AActuator assemblyMICRON TECHNOLOGY INC·Filed 1996·Granted Jul 1, 1997·6 cites·23 claims
- 2333US6221748B1Apparatus and method for providing mechanically pre-formed conductive leadsMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 24, 2001·2 cites·24 claims
- 2432US5831504AActuator assemblyMICRON TECHNOLOGY INC·Filed 1997·Granted Nov 3, 1998·2 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →