Inventor · disambiguated record
Hank Huang
Also filed as: HUANG HANK · HUANG HANK H
17 granted patents·1 pending application·380 citations·filing 2002–2023
93Inventor score
Top patents by PatentIndex Score
18 records- 0196US6656827B1Electrical performance enhanced wafer level chip scale package with groundTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 2, 2003·142 cites·20 claims
- 0294US6770958B2Under bump metallization structureTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Aug 3, 2004·80 cites·4 claims
- 0393US11810259B2System and method for generating asynchronous augmented reality instructionsPURDUE RESEARCH FOUNDATION·Filed 2022·Granted Nov 7, 2023·7 cites·20 claims
- 0493US11380069B2System and method for generating asynchronous augmented reality instructionsPURDUE RESEARCH FOUNDATION·Filed 2020·Granted Jul 5, 2022·8 cites·18 claims
- 0589US6596619B1Method for fabricating an under bump metallization structureTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jul 22, 2003·48 cites·11 claims
- 0688US6782897B2Method of protecting a passivation layer during solder bump formationTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 31, 2004·52 cites·18 claims
- 0770US6774026B1Structure and method for low-stress concentration solder bumpsTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 10, 2004·14 cites·8 claims
- 0869US6638837B1Method for protecting the front side of semiconductor wafersTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 28, 2003·12 cites·14 claims
- 0966US6960518B1Buildup substrate pad pre-solder bump manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 1, 2005·12 cites·6 claims
- 1060USD1073693SDisplay screen or portion thereof with iconGOOGLE LLC·Filed 2023·Granted May 6, 2025·2 cites·1 claims
- 1152USD1072870SDisplay screen or portion thereof with iconGOOGLE LLC·Filed 2023·Granted Apr 29, 2025·1 cites·1 claims
- 1247US7390697B2Enhanced adhesion strength between mold resin and polyimideTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jun 24, 2008·0 cites·14 claims
- 1347US6884662B1Enhanced adhesion strength between mold resin and polyimideTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 26, 2005·2 cites·17 claims
- 1440US2004217482A1Structure and method for low-stress concentration solder bumpsFiled 2004·Application pending·0 cites
- 1531USD1072867SDisplay screen or portion thereof with iconGOOGLE LLC·Filed 2023·Granted Apr 29, 2025·0 cites·1 claims
- 1631USD1072868SDisplay screen or portion thereof with iconGOOGLE LLC·Filed 2023·Granted Apr 29, 2025·0 cites·1 claims
- 1729USD1095600SDisplay screen or portion thereof with transitional graphical user interfaceGOOGLE LLC·Filed 2023·Granted Sep 30, 2025·0 cites·1 claims
- 1829USD1080682SDisplay screen or portion thereof with transitional graphical user interfaceGOOGLE LLC·Filed 2023·Granted Jun 24, 2025·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →