Inventor · disambiguated record
Craig Perlov
Also filed as: PERLOV CRAIG · PERLOV CRAIG M
19 granted patents·4 pending applications·653 citations·filing 1986–2020
95Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO14MAGNETIC PERIPHERALS INC4MEI PING1REDWAVE ENERGY INC1TAUSSIG CARL1
Top patents by PatentIndex Score
23 records- 0193US5557596AUltra-high density storage deviceFiled 1995·Granted Sep 17, 1996·278 cites·25 claims
- 0292US6646912B2Non-volatile memoryHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Nov 11, 2003·87 cites·30 claims
- 0390US6887792B2Embossed mask lithographyHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted May 3, 2005·54 cites·7 claims
- 0489US6690597B1Multi-bit PROM memory cellHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Feb 10, 2004·51 cites·14 claims
- 0589US4748525AProbe head for vertical recordingMAGNETIC PERIPHERALS INC·Filed 1987·Granted May 31, 1988·40 cites·1 claims
- 0688US6683322B2Flexible hybrid memory elementHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Jan 27, 2004·53 cites·16 claims
- 0787US7541227B2Thin film devices and methods for forming the sameHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Jun 2, 2009·15 cites·14 claims
- 0873US7678626B2Method and system for forming a thin film deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Mar 16, 2010·5 cites·19 claims
- 0973US6813182B2Diode-and-fuse memory elements for a write-once memory comprising an anisotropic semiconductor sheetHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Nov 2, 2004·18 cites·12 claims
- 1069US6919633B2Multi-section foldable memory deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Jul 19, 2005·12 cites·6 claims
- 1159US4667260AThin film vertical recording headMAGNETIC PERIPHERALS INC·Filed 1986·Granted May 19, 1987·11 cites·1 claims
- 1257US8021935B2Thin film device fabrication process using 3D templateHEWLETT PACKARD DEVELOPMENT CO·Filed 2008·Granted Sep 20, 2011·4 cites·19 claims
- 1357US4897749ACombination probe and ring head for vertical recordingMAGNETIC PERIPHERALS INC·Filed 1988·Granted Jan 30, 1990·12 cites·2 claims
- 1454US4788612AExtended metal in gap headMAGNETIC PERIPHERALS INC·Filed 1987·Granted Nov 29, 1988·9 cites·4 claims
- 1548US7304364B2Embossed mask lithographyHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Dec 4, 2007·2 cites·7 claims
- 1648US7199025B2Fabrication and assembly structures and methods for memory devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Apr 3, 2007·0 cites·11 claims
- 1748US7084007B2Fabrication and assembly structures and methods for memory devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Aug 1, 2006·2 cites·12 claims
- 1843US6864576B2Large line conductive pads for interconnection of stackable circuitryHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Mar 8, 2005·0 cites·10 claims
- 1942US6867132B2Large line conductive pads for interconnection of stackable circuitryHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Mar 15, 2005·0 cites·6 claims
- 2038US2006028895A1Silver island anti-fuseTAUSSIG CARL·Filed 2004·Application pending·0 cites
- 2138US2020274234A1System and Method for Making Electronic Structures and Antenna Coupled Terahertz Film with Nanoimprint or Roll-to-RollREDWAVE ENERGY INC·Filed 2020·Application pending·0 cites
- 2238US2005006640A1Polymer-based memory elementFiled 2003·Application pending·0 cites
- 2334US2011309365A1Thin film transistor backplaneMEI PING·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →