Inventor · disambiguated record
Hiroshi Kamikawa
Also filed as: KAMIKAWA HIROSHI
11 granted patents·1 pending application·64 citations·filing 1985–2007
88Inventor score
Top patents by PatentIndex Score
12 records- 0169US4895826AHeat-sensitive recording material with diazonium salt and coupler precursor with ester or urethane groupFUJI PHOTO FILM CO LTD·Filed 1988·Granted Jan 23, 1990·10 cites·11 claims
- 0268US5213939ALight- and heat-sensitive recording materialFUJI PHOTO FILM CO LTD·Filed 1991·Granted May 25, 1993·7 cites·19 claims
- 0368US4842979ABlack color heat-sensitive diazo microcapsule recording material with benzoylacetic amide couplerFUJI PHOTO FILM CO LTD·Filed 1987·Granted Jun 27, 1989·10 cites·8 claims
- 0463US4737484AHeat-sensitive recording materialFUJI PHOTO FILM CO LTD·Filed 1985·Granted Apr 12, 1988·8 cites·10 claims
- 0561US5547806AProcess for producing microcapsule containing diazonium salt compound and photo- and heat-sensitive recording material produced using the sameFUJI PHOTO FILM CO LTD·Filed 1994·Granted Aug 20, 1996·5 cites·18 claims
- 0658USD577393SToy building blockKOKUYO KK·Filed 2007·Granted Sep 23, 2008·12 cites·1 claims
- 0755US7176162B2Heat-sensitive recording materialFUJI PHOTO FILM CO LTD·Filed 2003·Granted Feb 13, 2007·1 cites·20 claims
- 0849US5543260ADiazo heat-sensitive recording materialFUJI PHOTO FILM CO LTD·Filed 1994·Granted Aug 6, 1996·3 cites·6 claims
- 0948US5486446AMulti-color heat-sensitive recording material utilizing multiple diazonium salt layersFUJI PHOTO FILM CO LTD·Filed 1994·Granted Jan 23, 1996·6 cites·4 claims
- 1048US2010112474A1Photosensitive composition, photosensitive film, method for forming a permanent pattern, and printed boardFUJIFILM CORP·Filed 2007·Application pending·0 cites
- 1144US7235512B2Heat-sensitive recording materialFUJI PHOTO FILM CO LTD·Filed 2003·Granted Jun 26, 2007·0 cites·12 claims
- 1238US4975353AHeat-sensitive recording materialsFUJI PHOTO FILM CO LTD·Filed 1989·Granted Dec 4, 1990·2 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →