Inventor · disambiguated record
Hyunkyu Lee
Also filed as: LEE HYUNKYU
3 granted patents·10 pending applications·4 citations·filing 2012–2025
54Inventor score
Files withSTATS CHIPPAC PTE LTD8SAMSUNG ELECTRONICS CO LTD2DOOSAN HEAVY IND & CONSTRUCTION CO LTD1JUNG JAEPIL1LG DISPLAY CO LTD1
Top patents by PatentIndex Score
13 records- 0174US9163301B2Method of producing tin emitted low alpha radiation by using vacuum refiningJUNG JAEPIL·Filed 2012·Granted Oct 20, 2015·4 cites·5 claims
- 0267US2025273595A1Semiconductor Device and Method for Selective EMI Shielding Using a MaskSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 0365US12327800B2Semiconductor device and method for selective EMI shielding using a maskSTATS CHIPPAC PTE LTD·Filed 2022·Granted Jun 10, 2025·0 cites·25 claims
- 0461US2025257218A1Compositions for near-infrared light-blocking filters, and image sensors including near-infrared light-blocking filtersSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0558US2024387577A1Optical sensor package and a method for forming the sameSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0657US2024387400A1Semiconductor device and method for making the sameSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0757US2024421138A1Semiconductor package and method for making the sameSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0852US2025336765A1Electronic package assembly with a cooling system and a method for forming the sameSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 0947US10927690B2Vane carrier, compressor, and gas turbine including the sameDOOSAN HEAVY IND & CONSTRUCTION CO LTD·Filed 2019·Granted Feb 23, 2021·0 cites·18 claims
- 1044US2025219288A1Antenna device and display device including an antenna unitLG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 1143US2025226288A1Semiconductor package assembly with an interlayer cooling pathwaySTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 1238US2025228032A1Omnidirectional sensor package and a method for making the sameSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 1334US2021042125A1Electronic device for executing instructions using processor cores and various versions of instruction set architecturesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →