Inventor · disambiguated record
Yasuji Hara
Also filed as: HARA YASUJI
8 granted patents·83 citations·filing 1997–2022
84Inventor score
Top patents by PatentIndex Score
8 records- 0183US6984456B2Flexible printed wiring board for chip-on flexiblesMITSUI MINING & SMELTING CO·Filed 2003·Granted Jan 10, 2006·24 cites·4 claims
- 0281US5958209AHigh tensile strength electrodeposited copper foil and process of electrodepositing thereofMITSUI MINING & SMELTING CO·Filed 1997·Granted Sep 28, 1999·33 cites·6 claims
- 0370US6444112B1Manufacturing method of electrodeposited copper foilMITSUI MINING & SMELTING CO·Filed 2000·Granted Sep 3, 2002·9 cites·9 claims
- 0465US12344953B2Electrolytic copper foilMITSUI MINING & SMELTING CO LTD·Filed 2021·Granted Jul 1, 2025·0 cites·4 claims
- 0564US6652725B2Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by the apparatusMITSUI MINING & SMELTING CO·Filed 2001·Granted Nov 25, 2003·4 cites·27 claims
- 0663US12168838B2Electrolytic copper foilMITSUI MINING & SMELTING CO LTD·Filed 2021·Granted Dec 17, 2024·0 cites·5 claims
- 0763US6194056B1High tensile strength electrodeposited copper foilMITSUI MINING & SMELTING CO·Filed 1999·Granted Feb 27, 2001·13 cites·8 claims
- 0862US12457686B2Roughened copper foil, copper-cladded laminate board, and printed wiring boardMITSUI MINING & SMELTING CO LTD·Filed 2022·Granted Oct 28, 2025·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →