Inventor · disambiguated record
Toshiko Yokota
Also filed as: YOKOTA TOSHIKO
6 granted patents·3 pending applications·70 citations·filing 1997–2014
82Inventor score
Top patents by PatentIndex Score
9 records- 0181US5958209AHigh tensile strength electrodeposited copper foil and process of electrodepositing thereofMITSUI MINING & SMELTING CO·Filed 1997·Granted Sep 28, 1999·33 cites·6 claims
- 0263US6194056B1High tensile strength electrodeposited copper foilMITSUI MINING & SMELTING CO·Filed 1999·Granted Feb 27, 2001·13 cites·8 claims
- 0360US7524552B2Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for manufacturing producing such copper foil with dielectric layer for formation of capacitor layerMITSUI MINING & SMELTING CO·Filed 2003·Granted Apr 28, 2009·8 cites·29 claims
- 0457US6835297B1High current density electrolytic decomposition process for copperMITSUI MINING & SMELTING CO·Filed 2000·Granted Dec 28, 2004·1 cites·19 claims
- 0549US2015101848A1Surface-treated copper foil and copper-clad laminate plate including the same, printed curcuit board using the same, and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0648US6322904B1Copper foil for printed circuit boardsMITSUI MINING & SMELTING CO·Filed 1997·Granted Nov 27, 2001·13 cites·11 claims
- 0748US2015156887A1Method of forming amorphous alloy film and printed wiring board manufactured by the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0839US2005161149A1Method of forming polymide coating containing dielectric filler on surface of metallic material process for producing copper clad laminate for formation of capacitor layer for printed wiring board and copper clad laminate obtained by the processMITSUI MINING & SMELTING CO·Filed 2003·Application pending·0 cites
- 0931US6071629AOrganic rust-proof treated copper foilMITSUI MINING & SMELTING CO·Filed 1997·Granted Jun 6, 2000·2 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →