Inventor · disambiguated record
Hiroshi Odaira
Also filed as: ODAIRA HIROSHI
9 granted patents·4 pending applications·499 citations·filing 1980–2010
91Inventor score
Files withTOSHIBA KK6YAMAICHI ELECTRONICS CO LTD2IIJIMA TOMOO1TESSERA INTERCONNECT MATERIALS1TOKYO SHIBAURA ELECTRIC CO1
Top patents by PatentIndex Score
13 records- 0196US5600103ACircuit devices and fabrication method of the sameTOSHIBA KK·Filed 1994·Granted Feb 4, 1997·129 cites·8 claims
- 0296US4395109AFixing device for electronic duplicator machineTOKYO SHIBAURA ELECTRIC CO·Filed 1980·Granted Jul 26, 1983·71 cites·8 claims
- 0393US6010769AMultilayer wiring board and method for forming the sameTOSHIBA KK·Filed 1996·Granted Jan 4, 2000·119 cites·59 claims
- 0486US5822850ACircuit devices and fabrication Method of the sameTOSHIBA KK·Filed 1995·Granted Oct 20, 1998·51 cites·23 claims
- 0583US5973395AIC package having a single wiring sheet with a lead pattern disposed thereonYAMAICHI ELECTRONICS CO LTD·Filed 1997·Granted Oct 26, 1999·83 cites·28 claims
- 0650US2010242270A1Wiring circuit board, manufacturing method for the wiring circuit board, and circuit moduleIIJIMA TOMOO·Filed 2010·Application pending·0 cites
- 0749US5407557AWiring boards and manufacturing methods thereofTOSHIBA KK·Filed 1994·Granted Apr 18, 1995·15 cites·15 claims
- 0845US5955780AContact converting structure of semiconductor chip and process for manufacturing semiconductor chip having said contact converting structureYAMAICHI ELECTRONICS CO LTD·Filed 1998·Granted Sep 21, 1999·13 cites·4 claims
- 0942US5310966AWiring boards and manufacturing methods thereofTOSHIBA KK·Filed 1993·Granted May 10, 1994·10 cites·10 claims
- 1042US2004201096A1Wiring circuit board, manufacturing method for the wiring circuit board, and circuit moduleFiled 2004·Application pending·0 cites
- 1141US2008264678A1Member for Interconnecting Wiring Films and Method for Producing the SameTESSERA INTERCONNECT MATERIALS·Filed 2005·Application pending·0 cites
- 1238US5333379AMethod of producing a three-dimensional wiring boardTOSHIBA KK·Filed 1992·Granted Aug 2, 1994·8 cites·8 claims
- 1332US2005097727A1Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring boardFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →