Inventor · disambiguated record
Fabian Schnoy
Also filed as: SCHNOY FABIAN
7 granted patents·1 pending application·11 citations·filing 2013–2022
77Inventor score
Top patents by PatentIndex Score
8 records- 0180US10373897B2Semiconductor devices with improved thermal and electrical performanceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Aug 6, 2019·4 cites·8 claims
- 0279US11302610B2Semiconductor package and method of fabricating a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Apr 12, 2022·2 cites·8 claims
- 0374US11211304B2Assembly and method for mounting an electronic component to a substrateINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Dec 28, 2021·2 cites·20 claims
- 0471US10651109B2Selective plating of semiconductor package leadsINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 12, 2020·2 cites·24 claims
- 0566US11776882B2Method of fabricating a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Oct 3, 2023·0 cites·22 claims
- 0664US9972576B2Semiconductor chip package comprising side wall markingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted May 15, 2018·1 cites·16 claims
- 0751US10085353B2Solder bridging prevention structures for circuit boards and semiconductor packagesINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 25, 2018·0 cites·20 claims
- 0841US2017278762A1Redirecting solder material to visually inspectable package surfaceINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →