Inventor · disambiguated record
Jayaganasan Narayanasamy
Also filed as: NARAYANASAMY JAYAGANASAN
8 granted patents·4 pending applications·3 citations·filing 2017–2024
74Inventor score
Top patents by PatentIndex Score
12 records- 0181US11908771B2Power semiconductor device with dual heat dissipation structuresINFINEON TECHNOLOGIES AG·Filed 2021·Granted Feb 20, 2024·1 cites·23 claims
- 0271US12334414B2Power semiconductor device with dual heat dissipation structuresINFINEON TECHNOLOGIES AG·Filed 2024·Granted Jun 17, 2025·0 cites·24 claims
- 0371US10651109B2Selective plating of semiconductor package leadsINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 12, 2020·2 cites·24 claims
- 0460US2025062273A1Package with Vertical Electronic Components Held Together by a ClipINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0555US11274984B2Pressure sensor having a lidless/laminate structureINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 15, 2022·0 cites·16 claims
- 0654US11984392B2Semiconductor package having a chip carrier with a pad offset featureINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 14, 2024·0 cites·20 claims
- 0749US2022278085A1Method for connecting an electrical device to a bottom unit by using a solderless jointINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 0846US10457001B2Method for forming a matrix composite layer and workpiece with a matrix composite layerINFINEON TECHNOLOGIES AG·Filed 2018·Granted Oct 29, 2019·0 cites·30 claims
- 0941US2022115245A1Power semiconductor package and method for fabricating a power semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 1037US11362023B2Package lead design with grooves for improved dambar separationINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 14, 2022·0 cites·17 claims
- 1135US10121723B1Semiconductor component and method for producing a semiconductor componentINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Nov 6, 2018·0 cites·21 claims
- 1231US2020020621A1Selective Plating of Semiconductor Package LeadsINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →