Inventor · disambiguated record
Jagen Krishnan
Also filed as: KRISHNAN JAGEN
5 granted patents·1 pending application·6 citations·filing 2014–2019
68Inventor score
Files withINFINEON TECHNOLOGIES AG6
Top patents by PatentIndex Score
6 records- 0171US10651109B2Selective plating of semiconductor package leadsINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 12, 2020·2 cites·24 claims
- 0266US9852918B2Embedding additive particles in encapsulant of electronic deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Dec 26, 2017·2 cites·22 claims
- 0362US10096508B2Assembly for handling a semiconductor die and method of handling a semiconductor dieINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 9, 2018·2 cites·18 claims
- 0446US10457001B2Method for forming a matrix composite layer and workpiece with a matrix composite layerINFINEON TECHNOLOGIES AG·Filed 2018·Granted Oct 29, 2019·0 cites·30 claims
- 0546US9540539B2Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jan 10, 2017·0 cites·14 claims
- 0631US2020020621A1Selective Plating of Semiconductor Package LeadsINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →