Inventor · disambiguated record
Fumihiro Shiraishi
Also filed as: SHIRAISHI FUMIHIRO
3 granted patents·12 pending applications·26 citations·filing 2004–2010
64Inventor score
Top patents by PatentIndex Score
15 records- 0190US9623705B2Method for producing modified conjugated diene polymer/copolymer, modified conjugated diene polymer/copolymer, and rubber composition and tire using the sameTANAKA KEN·Filed 2009·Granted Apr 18, 2017·21 cites·17 claims
- 0258US7365112B2Rubber composition and pneumatic tire using the sameBRIDGESTONE CORP·Filed 2004·Granted Apr 29, 2008·5 cites·11 claims
- 0352US2011221017A1Photosensitive resin composition, photosensitive adhesive film, and light-receiving deviceSUMITOMO BAKELITE CO·Filed 2009·Application pending·0 cites
- 0451US2011101484A1Light-receiving device and method of manufacturing the sameSUMITOMO BAKELITE CO·Filed 2009·Application pending·0 cites
- 0544US2009084484A1Rubber composition and run-flat tire using the sameBRIDGESTONE CORP·Filed 2007·Application pending·0 cites
- 0644US2011316116A1Photosensitive resin composition, adhesive film and light-receiving deviceSATO TOSHIHIRO·Filed 2010·Application pending·0 cites
- 0742US2011008611A1Photosensitive resin composition, film for photosensitive resin spacer, and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2009·Application pending·0 cites
- 0842US2012032284A1Film for resin spacer, light-receiving device and method for manufacturing same, and mems device and method for manufacturing sameDEJIMA HIROHISA·Filed 2010·Application pending·0 cites
- 0936US2011316127A1Spacer formation film, semiconductor wafer and semiconductor deviceSHIRAISHI FUMIHIRO·Filed 2010·Application pending·0 cites
- 1032US2012168970A1Spacer formation film, method of manufacturing semiconductor wafer bonding product, semiconductor wafer bonding product and semiconductor deviceSATO TOSHIHIRO·Filed 2010·Application pending·0 cites
- 1131US2012012989A1Method of manufacturing semiconductor wafer bonding product, semiconductor wafer bonding product and semiconductor deviceSATO TOSHIHIRO·Filed 2010·Application pending·0 cites
- 1230US2012187553A1Method of manufacturing semiconductor wafer bonding product, semiconductor wafer bonding product and semiconductor deviceYONEYAMA MASAHIRO·Filed 2010·Application pending·0 cites
- 1329US2011304034A1Semiconductor wafer bonding product, method of manufacturing semiconductor wafer bonding product and semiconductor deviceDEJIMA HIROHISA·Filed 2010·Application pending·0 cites
- 1427US8720511B2Run flat tireSHIRAISHI FUMIHIRO·Filed 2006·Granted May 13, 2014·0 cites·4 claims
- 1525US2012196075A1Resin composition, semiconductor wafer bonding product and semiconductor deviceTAKAHASHI TOYOSEI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →