Inventor · disambiguated record
Kejun Zeng
Also filed as: ZENG KEJUN
7 granted patents·9 pending applications·52 citations·filing 2003–2016
81Inventor score
Top patents by PatentIndex Score
16 records- 0190US7939939B1Stable gold bump solder connectionsTEXAS INSTRUMENTS INC·Filed 2007·Granted May 10, 2011·36 cites·4 claims
- 0265US7267861B2Solder joints for copper metallization having reduced interfacial voidsTEXAS INSTRUMENTS INC·Filed 2005·Granted Sep 11, 2007·3 cites·17 claims
- 0354US7005745B2Method and structure to reduce risk of gold embrittlement in solder jointsTEXAS INSTRUMENTS INC·Filed 2004·Granted Feb 28, 2006·5 cites·5 claims
- 0453US6867503B2Controlling interdiffusion rates in metal interconnection structuresTEXAS INSTRUMENTS INC·Filed 2003·Granted Mar 15, 2005·7 cites·26 claims
- 0552US7291549B2Method and structure to reduce risk of gold embrittlement in solder jointsTEXAS INSTRUMENTS INC·Filed 2005·Granted Nov 6, 2007·0 cites·13 claims
- 0648US2008251927A1Electromigration-Resistant Flip-Chip Solder JointsTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 0746US2009297879A1Structure and Method for Reliable Solder JointsTEXAS INSTRUMENTS INC·Filed 2009·Application pending·0 cites
- 0845US2011177686A1Stable Gold Bump Solder ConnectionsTEXAS INSTRUMENTS INC·Filed 2011·Application pending·0 cites
- 0944US2010219528A1Electromigration-Resistant Flip-Chip Solder JointsTEXAS INSTRUMENTS INC·Filed 2010·Application pending·0 cites
- 1043US7070088B2Method of semiconductor device assembly including fatigue-resistant ternary solder alloyTEXAS INSTRUMENTS INC·Filed 2004·Granted Jul 4, 2006·1 cites·8 claims
- 1142US9646950B2Corrosion-resistant copper bonds to aluminumTEXAS INSTRUMENTS INC·Filed 2016·Granted May 9, 2017·0 cites·15 claims
- 1240US2008083993A1Gold-Tin Solder Joints Having Reduced EmbrittlementTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 1334US2006038302A1Thermal fatigue resistant tin-lead-silver solderZENG KEJUN·Filed 2004·Application pending·0 cites
- 1434US2005275096A1Pre-doped reflow interconnections for copper padsZENG KEJUN·Filed 2004·Application pending·0 cites
- 1533US2005072834A1Connection site coating method and solder jointsFiled 2003·Application pending·0 cites
- 1628US2012001336A1Corrosion-resistant copper-to-aluminum bondsZENG KEJUN·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →