Inventor · disambiguated record
Kouji Kondoh
Also filed as: KONDOH KOUJI
9 granted patents·9 pending applications·62 citations·filing 2008–2025
84Inventor score
Top patents by PatentIndex Score
18 records- 0188US8128135B2Lock device for a vehicleMAETA KENJI·Filed 2008·Granted Mar 6, 2012·30 cites·15 claims
- 0282US9769879B2Radiation heater apparatusDENSO CORP·Filed 2013·Granted Sep 19, 2017·7 cites·22 claims
- 0374US8390106B2Circuit board with built-in semiconductor chip and method of manufacturing the sameMAEDA YUKIHIRO·Filed 2011·Granted Mar 5, 2013·3 cites·3 claims
- 0472US7804188B2Termination circuit, vehicle-mounted control apparatus, and vehicle-mounted communication systemDENSO CORP·Filed 2008·Granted Sep 28, 2010·5 cites·17 claims
- 0572US2025259902A1Semiconductor package, electronic device, and method for manufacturing semiconductor packageDENSO CORP·Filed 2025·Application pending·0 cites
- 0672US2025253198A1Semiconductor package, electronic device, and method for manufacturing semiconductor packageDENSO CORP·Filed 2025·Application pending·0 cites
- 0769US8118342B2Lock apparatus of seat for vehicleKOKUBO MOTOHIRO·Filed 2009·Granted Feb 21, 2012·17 cites·7 claims
- 0864US12400923B2Semiconductor package, electronic device, and method for manufacturing semiconductor packageDENSO CORP·Filed 2021·Granted Aug 26, 2025·0 cites·17 claims
- 0962US11985762B2Flexible laminated board and multilayer circuit boardUBE EXSYMO CO LTD·Filed 2021·Granted May 14, 2024·0 cites·4 claims
- 1059US2019359032A1Radiant heater deviceDENSO CORP·Filed 2019·Application pending·0 cites
- 1158US2016059669A1Radiant heater deviceDENSO CORP·Filed 2014·Application pending·0 cites
- 1254US2017318670A1Flexible laminated board and multilayer circuit boardUBE EXSYMO CO LTD·Filed 2016·Application pending·0 cites
- 1349US2010175806A1Method for filling conductive paste and method for manufacturing multilayer boardDENSO CORP·Filed 2009·Application pending·0 cites
- 1445US10427498B2Radiant heaterDENSO CORP·Filed 2015·Granted Oct 1, 2019·0 cites·13 claims
- 1544US2013114212A1Electrically conductive material and electronic device using sameDENSO CORP·Filed 2012·Application pending·0 cites
- 1639US2014118984A1Electronic device and method of manufacturing the sameDENSO CORP·Filed 2013·Application pending·0 cites
- 1736US2016066415A1Multilayer wiring boardDENSO CORP·Filed 2015·Application pending·0 cites
- 1827US8963017B2Multilayer boardMASUDA GENTARO·Filed 2012·Granted Feb 24, 2015·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →