Inventor · disambiguated record
Chin-Ho Lee
Also filed as: LEE CHIN-HO
10 granted patents·185 citations·filing 1974–2018
89Inventor score
Top patents by PatentIndex Score
10 records- 0186US5908542AMetal foil with improved bonding to substrates and method for making the foilGOULD ELECTRONICS INC·Filed 1997·Granted Jun 1, 1999·58 cites·24 claims
- 0283US11362287B2Luminescent cyclometalating tridentate ligand-containing gold(III) compounds with aryl auxiliary ligands for organic light-emitting devices and their preparation thereofUNIV HONG KONG·Filed 2017·Granted Jun 14, 2022·3 cites·13 claims
- 0382US5017271AMethod for printed circuit board pattern making using selectively etchable metal layersGOULD INC·Filed 1990·Granted May 21, 1991·55 cites·30 claims
- 0477US7601273B2Polishing slurry composition and method of using the sameCHEIL IND INC·Filed 2006·Granted Oct 13, 2009·8 cites·13 claims
- 0568US5908544AZinc-chromium stabilizer containing a hydrogen inhibiting additiveGOULD ELECTRONICS INC·Filed 1997·Granted Jun 1, 1999·19 cites·22 claims
- 0659US3978193AMethod and apparatus for treating exhaust gasesGOULD INC·Filed 1974·Granted Aug 31, 1976·20 cites·23 claims
- 0754US6221176B1Surface treatment of copper to prevent microcracking in flexible circuitsGOULD ELECTRONICS INC·Filed 1999·Granted Apr 24, 2001·17 cites·11 claims
- 0851US11274246B2Luminescent gold(III) compounds for organic light-emitting devicesUNIV HONG KONG·Filed 2018·Granted Mar 15, 2022·0 cites·25 claims
- 0937US6589413B2Method of making a copper on INVAR® compositeGOULD ELECTRONICS INC·Filed 2001·Granted Jul 8, 2003·0 cites·15 claims
- 1035US6168703B1Copper foil and laminate containing a hydrogen inhibitorGA TEK INC·Filed 1999·Granted Jan 2, 2001·5 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →