Inventor · disambiguated record
Vemmond Jeng Hung Ng
Also filed as: NG VEMMOND JENG HUNG
9 granted patents·4 pending applications·8 citations·filing 2020–2025
78Inventor score
Technology areasH10W
Files withSEMICONDUCTOR COMPONENTS IND LLC13
Top patents by PatentIndex Score
13 records- 0196US11830856B2Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Nov 28, 2023·8 cites·19 claims
- 0280US2025293213A1Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0380US2025380369A1Stacked power terminals in a power electronics moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0479US12347813B2Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 0578US12131981B2Power module package baseplate with step recess designSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Oct 29, 2024·0 cites·22 claims
- 0678US2025054839A1Power module package baseplate with step recess designSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0773US12402264B2Stacked power terminals in a power electronics moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Aug 26, 2025·0 cites·22 claims
- 0871US2025246572A1Clip design and method of controlling clip positionSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0970US12283562B2Clip design and method of controlling clip positionSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Apr 22, 2025·0 cites·20 claims
- 1068US11735504B2Power module package baseplate with step recess designSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Aug 22, 2023·0 cites·20 claims
- 1164US12300558B2Substrates and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted May 13, 2025·0 cites·17 claims
- 1255US11482468B2Power module package casing with protrusion supportsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Oct 25, 2022·0 cites·20 claims
- 1352US12513870B2Power moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Dec 30, 2025·0 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →