Inventor · disambiguated record
Bo-Sen Chang
Also filed as: CHANG BO-SEN
11 granted patents·1 pending application·30 citations·filing 2012–2023
87Inventor score
Top patents by PatentIndex Score
12 records- 0193US10283496B2Integrated circuit filler and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·10 cites·20 claims
- 0291US10679980B2Integrated circuit filler and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 9, 2020·5 cites·20 claims
- 0390US11762302B2Integrated circuit overlay test patterns and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 19, 2023·2 cites·20 claims
- 0489US11309307B2Integrated circuit filler and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·2 cites·20 claims
- 0587US10388645B2Integrated circuit filler and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 20, 2019·3 cites·20 claims
- 0684US12183729B2Integrated circuit filler and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 0778US11776948B2Integrated circuit filler and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 3, 2023·0 cites·20 claims
- 0877US8438505B2Method for improving accuracy of parasitics extraction considering sub-wavelength lithography effectsTSAI KUEN-YU·Filed 2012·Granted May 7, 2013·8 cites·19 claims
- 0976US12271116B2Method of measuring mask overlay using test patternsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 1056US11016398B2Integrated circuit overlay test patterns and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 25, 2021·0 cites·20 claims
- 1144US2019378381A1Method for notifying a user via a computer systemPEGATRON CORP·Filed 2019·Application pending·0 cites
- 1218US9538022B2Method for applying cloud-based time-lapse imaging systemsRAYLIOS TECH INC·Filed 2015·Granted Jan 3, 2017·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →