Inventor · disambiguated record
Sung Won Moon
Also filed as: MOON SUNG · MOON SUNG W · MOON SUNG-WON
11 granted patents·13 pending applications·33 citations·filing 2005–2024
85Inventor score
Files withELECTRONICS & TELECOMMUNICATIONS RES INST63M INNOVATIVE PROPERTIES COMPANY4MOON SUNG-WON3INTEL CORP2KOREA ELECTRONICS TELECOMM2
Top patents by PatentIndex Score
24 records- 0194US12004321B2Rack-mountable immersion cooling system3M INNOVATIVE PROPERTIES COMPANY·Filed 2020·Granted Jun 4, 2024·6 cites·16 claims
- 0283US7595468B2Passive thermal solution for hand-held devicesINTEL CORP·Filed 2005·Granted Sep 29, 2009·15 cites·4 claims
- 0374US8534574B2Underfill material dispenserSIMION BOGDAN M·Filed 2010·Granted Sep 17, 2013·6 cites·12 claims
- 0468US8951846B2Controlling thermal interface material bleed outKRISHNAN GOPI·Filed 2012·Granted Feb 10, 2015·4 cites·21 claims
- 0564US2025165710A1Method and analysis device thereof for analyzing degree of correlation between image generated by generative model and text promptELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2024·Application pending·0 cites
- 0662US10298045B2Electronic device for checking battery abnormality and control method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 21, 2019·1 cites·20 claims
- 0758US2025054281A1Method and apparatus for data augmentation based on outpaintingELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2024·Application pending·0 cites
- 0857US11619859B2Single optical phase array and photosensing system including the sameRESEARCH & BUSINESS FOUND SUNGKYUNKWAN UNIV·Filed 2021·Granted Apr 4, 2023·0 cites·18 claims
- 0957US7589395B2Multiple-dice packages using elements between dice to control application of underfill material to reduce void formationINTEL CORP·Filed 2006·Granted Sep 15, 2009·1 cites·18 claims
- 1055US2025173381A1Device for providing tourism information and method thereofELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2024·Application pending·0 cites
- 1153US12412807B2Patterned design for thermal management of two-phase immersion cooling system for electronics3M INNOVATIVE PROPERTIES COMPANY·Filed 2020·Granted Sep 9, 2025·0 cites·10 claims
- 1252US11501119B2Apparatus and method for identifying warshipELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Granted Nov 15, 2022·0 cites·11 claims
- 1351US2022200234A1Integrated light receiving and emitting device combined with control circuit wafer and method thereofRESEARCH & BUSINESS FOUND SUNGKYUNKWAN UNIV·Filed 2021·Application pending·0 cites
- 1448US2024130077A1Multichannel manifold cold plate3M INNOVATIVE PROPERTIES COMPANY·Filed 2022·Application pending·0 cites
- 1546US10762659B2Real time multi-object tracking apparatus and method using global motionELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2018·Granted Sep 1, 2020·0 cites·12 claims
- 1644US2023230852A1Cold plate made via 3d printing3M INNOVATIVE PROPERTIES COMPANY·Filed 2021·Application pending·0 cites
- 1743US2010008047A1Passive thermal solution for hand-held devicesMOON SUNG-WON·Filed 2009·Application pending·0 cites
- 1842US2015138038A1Multi-screen display system and image signal correcting method for the sameKOREA ELECTRONICS TELECOMM·Filed 2014·Application pending·0 cites
- 1942US2015138067A1Method of transmitting and receiving data, and display apparatus and pointing apparatus using the sameKOREA ELECTRONICS TELECOMM·Filed 2014·Application pending·0 cites
- 2040US2014308932A1Method of and apparatus for transmitting/receiving digital signage contentsELECT & TELECOMM RESEARCH INST·Filed 2013·Application pending·0 cites
- 2138US2019392591A1Apparatus and method for detecting moving object using optical flow predictionELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2018·Application pending·0 cites
- 2236US2015060527A1Non-uniform heater for reduced temperature gradient during thermal compression bondingTANG WEIHUA·Filed 2013·Application pending·0 cites
- 2333US10634130B2Compact voice coil driven high flow fluid pumps and methodsMOON SUNG WON·Filed 2016·Granted Apr 28, 2020·0 cites·14 claims
- 2433US2007090517A1Stacked die package with thermally conductive block embedded in substrateMOON SUNG-WON·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →