Inventor · disambiguated record
Po-Yuan Su
Also filed as: SU PO-YUAN
6 granted patents·8 pending applications·5 citations·filing 2013–2024
70Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD6TAIWAN SEMICONDUCTOR MFG CO LTD3FOXCONN INTERCONNECT TECHNOLOGY LTD2FOXCONN KUNSHAN COMPUTER CONNECTOR CO LTD2JENTECH PREC INDUSTRIAL CO LTD1
Top patents by PatentIndex Score
14 records- 0173US2025087601A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0267US12199047B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·6 claims
- 0367US9799972B2Electrical connector having a plurality of sockets attached to an interior cross structure and exterior peripheral structure of a frameFOXCONN INTERCONNECT TECHNOLOGY LTD·Filed 2016·Granted Oct 24, 2017·3 cites·8 claims
- 0457US9876299B2Electrical connector assembly with floating supportFOXCONN INTERCONNECT TECHNOLOGY LTD·Filed 2017·Granted Jan 23, 2018·1 cites·20 claims
- 0556US2025140770A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0655US10653028B2Connector equipped with carrier frame and rail frame for CPUFOXCONN KUNSHAN COMPUTER CONNECTOR CO LTD·Filed 2019·Granted May 12, 2020·1 cites·19 claims
- 0755US2025079254A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0855US2025142940A1Semiconductor device including gate dielectrics of different thicknesses and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0953US2024363545A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 1052US2024264389A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 1151US2025022958A1Semiconductor device and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1251US2025277499A1Connecting pieceJENTECH PREC INDUSTRIAL CO LTD·Filed 2024·Application pending·0 cites
- 1342US9082617B2Integrated circuit and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 14, 2015·0 cites·20 claims
- 1439US10541481B2Connector equipped with carrier frame and rail frame for CPUFOXCONN KUNSHAN COMPUTER CONNECTOR CO LTD·Filed 2019·Granted Jan 21, 2020·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →