Inventor · disambiguated record
Navinchandra Kalidas
Also filed as: KALIDAS NAVINCHANDRA
11 granted patents·3 pending applications·485 citations·filing 1983–2008
91Inventor score
Technology areasH10W
Top patents by PatentIndex Score
14 records- 0193US5895967ABall grid array package having a deformable metal layer and methodTEXAS INSTRUMENTS INC·Filed 1998·Granted Apr 20, 1999·192 cites·25 claims
- 0287US6084777ABall grid array packageTEXAS INSTRUMENTS INC·Filed 1998·Granted Jul 4, 2000·99 cites·14 claims
- 0384US6396136B2Ball grid package with multiple power/ground planesTEXAS INSTRUMENTS INC·Filed 1999·Granted May 28, 2002·87 cites·2 claims
- 0476US4540226AIntelligent electronic connection socketTEXAS INSTRUMENTS INC·Filed 1983·Granted Sep 10, 1985·47 cites·6 claims
- 0572US5777382APlastic packaging for a surface mounted integrated circuitTEXAS INSTRUMENTS INC·Filed 1996·Granted Jul 7, 1998·42 cites·9 claims
- 0666US6794743B1Structure and method of high performance two layer ball grid array substrateTEXAS INSTRUMENTS INC·Filed 2000·Granted Sep 21, 2004·10 cites·27 claims
- 0756US7309648B2Low profile, chip-scale package and method of fabricationTEXAS INSTRUMENTS INC·Filed 2006·Granted Dec 18, 2007·1 cites·8 claims
- 0853US7795072B2Structure and method of high performance two layer ball grid array substrateTEXAS INSTRUMENTS INC·Filed 2008·Granted Sep 14, 2010·0 cites·6 claims
- 0949US7135781B2Low profile, chip-scale package and method of fabricationTEXAS INSTRUMENTS INC·Filed 2004·Granted Nov 14, 2006·4 cites·14 claims
- 1048US6995037B2Structure and method of high performance two layer ball grid array substrateTEXAS INSTRUMENTS INC·Filed 2003·Granted Feb 7, 2006·2 cites·6 claims
- 1148US2006063304A1Structure and method of high performance two layer ball grid array substrateLAMSON MICHAEL A·Filed 2005·Application pending·0 cites
- 1239US2006185895A1Universal pattern of contact pads for semiconductor reflow interconnectionsKALIDAS NAVINCHANDRA·Filed 2005·Application pending·0 cites
- 1337US2005093170A1Integrated interconnect packageTEXAS INSTRUMENTS INC·Filed 2003·Application pending·0 cites
- 1428US5976914AMethod of making plastic package for a surface mounted integrated circuitTEXAS INSTRUMENTS INC·Filed 1997·Granted Nov 2, 1999·1 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →