Inventor · disambiguated record
Elizabeth Foster
Also filed as: FOSTER ELIZABETH · FOSTER ELIZABETH F
29 granted patents·698 citations·filing 1991–2005
98Inventor score
Top patents by PatentIndex Score
29 records- 0195US6373717B1Electronic package with high density interconnect layerIBM·Filed 2000·Granted Apr 16, 2002·97 cites·16 claims
- 0295US5374454AMethod for conditioning halogenated polymeric materials and structures fabricated therewithIBM·Filed 1993·Granted Dec 20, 1994·71 cites·39 claims
- 0389US6156484AGray scale etching for thin flexible interposerIBM·Filed 1998·Granted Dec 5, 2000·78 cites·12 claims
- 0485US6829823B2Method of making a multi-layered interconnect structureIBM·Filed 2002·Granted Dec 14, 2004·31 cites·25 claims
- 0582US5730890AMethod for conditioning halogenated polymeric materials and structures fabricated therewithIBM·Filed 1996·Granted Mar 24, 1998·35 cites·29 claims
- 0682US5591285AFluorinated carbon polymer compositesIBM·Filed 1995·Granted Jan 7, 1997·38 cites·12 claims
- 0781US5397863AFluorinated carbon polymer compositesIBM·Filed 1992·Granted Mar 14, 1995·35 cites·17 claims
- 0880US6706464B2Method of fabricating circuitized structuresIBM·Filed 2003·Granted Mar 16, 2004·15 cites·8 claims
- 0980US6522014B1Fabrication of a metalized blind viaIBM·Filed 2000·Granted Feb 18, 2003·23 cites·20 claims
- 1076US6528218B1Method of fabricating circuitized structuresIBM·Filed 2001·Granted Mar 4, 2003·12 cites·8 claims
- 1176US5556899AFluorinated carbon polymer compositesIBM·Filed 1994·Granted Sep 17, 1996·28 cites·8 claims
- 1272US7332212B2Circuitized substrate with conductive polymer and seed material adhesion layerENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Feb 19, 2008·5 cites·6 claims
- 1372US6924224B2Method of forming filled blind viasIBM·Filed 2003·Granted Aug 2, 2005·16 cites·22 claims
- 1472US5800858AMethod for conditioning halogenated polymeric materials and structures fabricated therewithIBM·Filed 1996·Granted Sep 1, 1998·20 cites·7 claims
- 1571US5863332AFluid jet impregnating and coating device with thickness control capabilityIBM·Filed 1996·Granted Jan 26, 1999·26 cites·3 claims
- 1669US5725668AExpandable fluid treatment device for tublar surface treatmentsIBM·Filed 1996·Granted Mar 10, 1998·22 cites·19 claims
- 1768US5571852AFluorinated carbon polymer compositesIBM·Filed 1995·Granted Nov 5, 1996·20 cites·14 claims
- 1865US5824157AFluid jet impregnationIBM·Filed 1995·Granted Oct 20, 1998·21 cites·18 claims
- 1962US5158645AMethod of external circuitization of a circuit panelIBM·Filed 1991·Granted Oct 27, 1992·28 cites·38 claims
- 2060US7084509B2Electronic package with filled blinds viasIBM·Filed 2002·Granted Aug 1, 2006·8 cites·9 claims
- 2159US6634543B2Method of forming metallic z-interconnects for laminate chip packages and boardsIBM·Filed 2002·Granted Oct 21, 2003·7 cites·17 claims
- 2258US6835533B2Photoimageable dielectric epoxy resin system filmIBM·Filed 2004·Granted Dec 28, 2004·5 cites·7 claims
- 2358US5709906AMethod for conditioning halogenated polymeric materials and structures fabricated therewithIBM·Filed 1995·Granted Jan 20, 1998·12 cites·33 claims
- 2456US6576549B2Fabrication of a metalized blind viaIBM·Filed 2002·Granted Jun 10, 2003·5 cites·23 claims
- 2554US7063762B2Circuitized substrate and method of making sameENDICOTT INTERCONNECT TECH INC·Filed 2003·Granted Jun 20, 2006·6 cites·12 claims
- 2651US6843929B1Accelerated etching of chromiumIBM·Filed 2000·Granted Jan 18, 2005·3 cites·20 claims
- 2750US5874154AStructure including a partially electrochemically reduced halogenated polymeric containing layer and an electrically conductive patternIBM·Filed 1996·Granted Feb 23, 1999·9 cites·7 claims
- 2847US6335495B1Patterning a layered chrome-copper structure disposed on a dielectric substrateIBM·Filed 1999·Granted Jan 1, 2002·11 cites·10 claims
- 2944US6207351B1Method for pattern seeding and plating of high density printed circuit boardsIBM·Filed 1995·Granted Mar 27, 2001·11 cites·5 claims
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