Inventor · disambiguated record
Chao-Kun Hu
Also filed as: HU CHAO-KUN
41 granted patents·5 pending applications·2,092 citations·filing 1991–2020
98Inventor score
Top patents by PatentIndex Score
46 records- 0199US6342733B1Reduced electromigration and stressed induced migration of Cu wires by surface coatingIBM·Filed 1999·Granted Jan 29, 2002·506 cites·11 claims
- 0298US6181012B1Copper interconnection structure incorporating a metal seed layerIBM·Filed 1998·Granted Jan 30, 2001·335 cites·30 claims
- 0397US8039966B2Structures of and methods and tools for forming in-situ metallic/dielectric caps for interconnectsIBM·Filed 2009·Granted Oct 18, 2011·54 cites·26 claims
- 0497US6573606B2Chip to wiring interface with single metal alloy layer applied to surface of copper interconnectIBM·Filed 2001·Granted Jun 3, 2003·307 cites·8 claims
- 0595US8232196B2Interconnect structure having a via with a via gouging feature and dielectric liner sidewalls for BEOL integrationYANG CHIH-CHAO·Filed 2009·Granted Jul 31, 2012·31 cites·14 claims
- 0695US6975032B2Copper recess process with application to selective capping and electroless platingIBM·Filed 2002·Granted Dec 13, 2005·85 cites·19 claims
- 0795US6399496B1Copper interconnection structure incorporating a metal seed layerIBM·Filed 2000·Granted Jun 4, 2002·94 cites·21 claims
- 0894US9472477B1Electromigration test structure for Cu barrier integrity and blech effect evaluationsIBM·Filed 2015·Granted Oct 18, 2016·6 cites·9 claims
- 0994US7247946B2On-chip Cu interconnection using 1 to 5 nm thick metal capIBM·Filed 2005·Granted Jul 24, 2007·35 cites·14 claims
- 1093US8796853B2Metallic capped interconnect structure with high electromigration resistance and low resistivityYANG CHIH-CHAO·Filed 2012·Granted Aug 5, 2014·17 cites·15 claims
- 1193US8232646B2Interconnect structure for integrated circuits having enhanced electromigration resistanceBONILLA GRISELDA·Filed 2010·Granted Jul 31, 2012·17 cites·15 claims
- 1293US8013446B2Nitrogen-containing metal cap for interconnect structuresIBM·Filed 2008·Granted Sep 6, 2011·26 cites·18 claims
- 1392US7468320B2Reduced electromigration and stressed induced migration of copper wires by surface coatingIBM·Filed 2005·Granted Dec 23, 2008·14 cites·9 claims
- 1492US7064064B2Copper recess process with application to selective capping and electroless platingIBM·Filed 2005·Granted Jun 20, 2006·22 cites·10 claims
- 1592US6063506ACopper alloys for chip and package interconnectionsIBM·Filed 1998·Granted May 16, 2000·116 cites·59 claims
- 1691US8056039B2Interconnect structure for integrated circuits having improved electromigration characteristicsIBM·Filed 2008·Granted Nov 8, 2011·23 cites·17 claims
- 1791US7301236B2Increasing electromigration lifetime and current density in IC using vertically upwardly extending dummy viaIBM·Filed 2005·Granted Nov 27, 2007·18 cites·17 claims
- 1889US8133767B2Efficient interconnect structure for electrical fuse applicationsYANG CHIH-CHAO·Filed 2010·Granted Mar 13, 2012·9 cites·8 claims
- 1988US5055158APlanarization of Josephson integrated circuitIBM·Filed 1991·Granted Oct 8, 1991·78 cites·14 claims
- 2087US7439173B2Increasing electromigration lifetime and current density in IC using vertically upwardly extending dummy viaIBM·Filed 2007·Granted Oct 21, 2008·13 cites·13 claims
- 2186US6709562B1Method of making electroplated interconnection structures on integrated circuit chipsIBM·Filed 1999·Granted Mar 23, 2004·90 cites·49 claims
- 2286US6380075B1Method for forming an open-bottom liner for a conductor in an electronic structure and device formedIBM·Filed 2000·Granted Apr 30, 2002·36 cites·10 claims
- 2386US6090710AMethod of making copper alloys for chip and package interconnectionsIBM·Filed 1997·Granted Jul 18, 2000·73 cites·16 claims
- 2484US10192829B2Low-temperature diffusion doping of copper interconnects independent of seed layer compositionIBM·Filed 2017·Granted Jan 29, 2019·3 cites·12 claims
- 2584US7737528B2Structure and method of forming electrically blown metal fuses for integrated circuitsIBM·Filed 2008·Granted Jun 15, 2010·12 cites·20 claims
- 2683US9754891B2Low-temperature diffusion doping of copper interconnects independent of seed layer compositionIBM·Filed 2015·Granted Sep 5, 2017·3 cites·18 claims
- 2783US7893520B2Efficient interconnect structure for electrical fuse applicationsIBM·Filed 2008·Granted Feb 22, 2011·9 cites·17 claims
- 2882US9111938B2Copper interconnect with CVD liner and metallic capIBM·Filed 2014·Granted Aug 18, 2015·5 cites·8 claims
- 2982US9059176B2Copper interconnect with CVD liner and metallic capBAUMANN FRIEDER HAINRICH·Filed 2012·Granted Jun 16, 2015·8 cites·18 claims
- 3076US6946716B2Electroplated interconnection structures on integrated circuit chipsIBM·Filed 2004·Granted Sep 20, 2005·16 cites·27 claims
- 3173US6448173B1Aluminum-based metallization exhibiting reduced electromigration and method thereforIBM·Filed 2000·Granted Sep 10, 2002·21 cites·12 claims
- 3266US8823176B2Discontinuous/non-uniform metal cap structure and process for interconnect integrationYANG CHIH-CHAO·Filed 2008·Granted Sep 2, 2014·2 cites·19 claims
- 3364US8026166B2Interconnect structures comprising capping layers with low dielectric constants and methods of making the sameIBM·Filed 2008·Granted Sep 27, 2011·3 cites·7 claims
- 3463US10580740B2Low-temperature diffusion doping of copper interconnects independent of seed layer compositionIBM·Filed 2018·Granted Mar 3, 2020·0 cites·20 claims
- 3562US10943863B2Techniques to improve reliability in Cu interconnects using Cu intermetallicsIBM·Filed 2019·Granted Mar 9, 2021·0 cites·19 claims
- 3662US10818590B2Techniques to improve reliability in Cu interconnects using Cu intermetallicsIBM·Filed 2019·Granted Oct 27, 2020·0 cites·13 claims
- 3759US9759766B2Electromigration test structure for Cu barrier integrity and blech effect evaluationsIBM·Filed 2016·Granted Sep 12, 2017·0 cites·4 claims
- 3859US2009142924A1Reduced electromigration and stressed induced migration of cu wires by surface coatingIBM·Filed 2008·Application pending·0 cites
- 3954US10461026B2Techniques to improve reliability in Cu interconnects using Cu intermetallicsIBM·Filed 2016·Granted Oct 29, 2019·0 cites·9 claims
- 4053US6503641B2Interconnects with Ti-containing linersIBM·Filed 2000·Granted Jan 7, 2003·5 cites·13 claims
- 4150US8889546B2Discontinuous/non-uniform metal cap structure and process for interconnect integrationYANG CHIH-CHAO·Filed 2012·Granted Nov 18, 2014·0 cites·15 claims
- 4249US11557482B2Electrode with alloy interfaceIBM·Filed 2019·Granted Jan 17, 2023·0 cites·8 claims
- 4349US2012199976A1Interconnect structure having a via with a via gouging feature and dielectric liner sidewalls for beol integrationYANG CHIH-CHAO·Filed 2012·Application pending·0 cites
- 4448US2006017169A1Electroplated interconnection structures on integrated circuit chipsIBM·Filed 2005·Application pending·0 cites
- 4547US2021257299A1Hybrid interconnect with a reliability liner in wide featuresIBM·Filed 2020·Application pending·0 cites
- 4642US2002098681A1Reduced electromigration and stressed induced migration of Cu wires by surface coatingFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →