Inventor · disambiguated record
Kunal R. Parekh
Also filed as: PAREKH KUNAL · PAREKH KUNAL R
286 granted patents·101 pending applications·4,128 citations·filing 1995–2025
99Inventor score
Files withMICRON TECHNOLOGY INC349LODESTAR LICENSING GROUP LLC11KIRBY KYLE K4PAREKH KUNAL R4APTINA IMAGING CORP2
Top patents by PatentIndex Score
387 records- 0199US11817305B2Front end of line interconnect structures and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Nov 14, 2023·8 cites·19 claims
- 0299US11705367B2Methods of forming microelectronic devices, and related microelectronic devices, memory devices, electronic systems, and additional methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Jul 18, 2023·6 cites·6 claims
- 0399US11563018B2Microelectronic devices, and related methods, memory devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 24, 2023·10 cites·23 claims
- 0499US11557569B2Microelectronic devices including source structures overlying stack structures, and related electronic systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 17, 2023·13 cites·8 claims
- 0599US11380669B2Methods of forming microelectronic devicesMICRON TECHNOLOGY INC·Filed 2020·Granted Jul 5, 2022·10 cites·20 claims
- 0699US11335602B2Methods of forming microelectronic devices, and related microelectronic devices and electronic systemsMICRON TECHNOLOGY INC·Filed 2020·Granted May 17, 2022·10 cites·19 claims
- 0799US8030780B2Semiconductor substrates with unitary vias and via terminals, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2008·Granted Oct 4, 2011·254 cites·13 claims
- 0899US7384849B2Methods of forming recessed access devices associated with semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2005·Granted Jun 10, 2008·113 cites·20 claims
- 0999US6306705B1Methods of forming capacitors, DRAM arrays, and monolithic integrated circuitsMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 23, 2001·253 cites·6 claims
- 1098US12112793B2Signal routing between memory die and logic die for mode based operationsMICRON TECHNOLOGY INC·Filed 2022·Granted Oct 8, 2024·5 cites·29 claims
- 1198US11751408B2Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2021·Granted Sep 5, 2023·5 cites·25 claims
- 1298US11545456B2Microelectronic devices, electronic systems having a memory array region and a control logic region, and methods of forming microelectronic devicesMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 3, 2023·14 cites·25 claims
- 1398US11482538B2Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Oct 25, 2022·4 cites·17 claims
- 1498US11282815B2Methods of forming microelectronic devices, and related microelectronic devices and electronic systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 22, 2022·14 cites·11 claims
- 1598US10014309B2Methods of forming an array of elevationally-extending strings of memory cells comprising a programmable charge storage transistor and arrays of elevationally-extending strings of memory cells comprising a programmable charge storage transistorMICRON TECHNOLOGY INC·Filed 2016·Granted Jul 3, 2018·34 cites·26 claims
- 1698US7968460B2Semiconductor with through-substrate interconnectMICRON TECHNOLOGY INC·Filed 2008·Granted Jun 28, 2011·52 cites·17 claims
- 1798US7622365B2Wafer processing including dicingMICRON TECHNOLOGY INC·Filed 2008·Granted Nov 24, 2009·70 cites·20 claims
- 1898US6261964B1Material removal method for forming a structureMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 17, 2001·309 cites·86 claims
- 1997US12165696B2Signal routing between memory die and logic dieMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 10, 2024·3 cites·17 claims
- 2097US12112792B2Memory device for wafer-on-wafer formed memory and logicMICRON TECHNOLOGY INC·Filed 2022·Granted Oct 8, 2024·3 cites·28 claims
- 2197US11915742B2Wafer-on-wafer formed memory and logic for genomic annotationsMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 27, 2024·2 cites·20 claims
- 2297US11842990B2Microelectronic devices and electronic systemsMICRON TECHNOLOGY INC·Filed 2021·Granted Dec 12, 2023·5 cites·10 claims
- 2397US11825658B2Methods of forming microelectronic devices and memory devicesMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 21, 2023·4 cites·13 claims
- 2497US11699652B2Microelectronic devices and electronic systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Jul 11, 2023·4 cites·8 claims
- 2597US8067286B2Methods of forming recessed access devices associated with semiconductor constructionsPAREKH KUNAL R·Filed 2011·Granted Nov 29, 2011·39 cites·14 claims
- 2696US11837594B2Microelectronic devices and electronic systemsMICRON TECHNOLOGY INC·Filed 2021·Granted Dec 5, 2023·3 cites·13 claims
- 2796US10388665B1Methods of forming an array of elevationally-extending strings of memory cells having a stack comprising vertically-alternating insulative tiers and wordline tiers and horizontally-elongated trenches in the stackMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 20, 2019·46 cites·22 claims
- 2896US10256249B2Integrated structuresMICRON TECHNOLOGY INC·Filed 2017·Granted Apr 9, 2019·10 cites·7 claims
- 2996US10229923B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2017·Granted Mar 12, 2019·10 cites·20 claims
- 3096US7897485B2Wafer processing including forming trench rows and columns at least one of which has a different widthMICRON TECHNOLOGY INC·Filed 2009·Granted Mar 1, 2011·36 cites·20 claims
- 3195US10263007B2Methods of forming an array of elevationally-extending strings of memory cells comprising a programmable charge storage transistor and arrays of elevationally-extending strings of memory cells comprising a programmable charge storage transistorMICRON TECHNOLOGY INC·Filed 2018·Granted Apr 16, 2019·11 cites·18 claims
- 3295US8629527B2Semiconductor structuresPAREKH KUNAL R·Filed 2011·Granted Jan 14, 2014·20 cites·19 claims
- 3395US7897460B2Methods of forming recessed access devices associated with semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2008·Granted Mar 1, 2011·25 cites·12 claims
- 3495US7378704B2Semiconductor constructions, and methods of forming semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2006·Granted May 27, 2008·31 cites·39 claims
- 3594US11862569B2Front end of line interconnect structures and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 2, 2024·2 cites·11 claims
- 3694US7902028B2Methods of forming field effect transistors, methods of forming field effect transistor gates, methods of forming integrated circuitry comprising a transistor gate array and circuitry peripheral to the gate array, and methods of forming integrated circuitry comprising a transistor gate array including first gates and second grounded isolation gatesMICRON TECHNOLOGY INC·Filed 2010·Granted Mar 8, 2011·16 cites·42 claims
- 3794US6309975B1Methods of making implanted structuresMICRON TECHNOLOGY INC·Filed 1997·Granted Oct 30, 2001·83 cites·72 claims
- 3894US6174785B1Method of forming trench isolation region for semiconductor deviceMICRON TECHNOLOGY INC·Filed 1998·Granted Jan 16, 2001·160 cites·56 claims
- 3994US5686747AIntegrated circuits comprising interconnecting plugsMICRON TECHNOLOGY INC·Filed 1996·Granted Nov 11, 1997·124 cites·19 claims
- 4093US11785764B2Methods of forming microelectronic devicesMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 10, 2023·2 cites·16 claims
- 4193US11088169B2Integrated assemblies having thicker semiconductor material along one region of a conductive structure than along another region, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 10, 2021·2 cites·9 claims
- 4293US8404587B2Semiconductor with through-substrate interconnectKIRBY KYLE K·Filed 2011·Granted Mar 26, 2013·11 cites·15 claims
- 4393US7767525B2Methods of forming vertical transistor structuresMICRON TECHNOLOGY INC·Filed 2006·Granted Aug 3, 2010·21 cites·16 claims
- 4493US7700441B2Methods of forming field effect transistors, methods of forming field effect transistor gates, methods of forming integrated circuitry comprising a transistor gate array and circuitry peripheral to the gate array, and methods of forming integrated circuitry comprising a transistor gate array including first gates and second grounded isolation gatesMICRON TECHNOLOGY INC·Filed 2006·Granted Apr 20, 2010·21 cites·30 claims
- 4593US7157757B2Semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 2, 2007·24 cites·10 claims
- 4693US6599840B2Material removal method for forming a structureMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 29, 2003·54 cites·51 claims
- 4793US5821140AMethod of forming a bit line over capacitor array of memory cells and an array of bit line over capacitor array of memory cellsMICRON TECHNOLOGY INC·Filed 1996·Granted Oct 13, 1998·115 cites·9 claims
- 4892US8901700B2Semiconductor structuresMICRON TECHNOLOGY INC·Filed 2013·Granted Dec 2, 2014·8 cites·19 claims
- 4992US8716116B2Method of forming a DRAM array of devices with vertically integrated recessed access device and digitlinePAREKH KUNAL·Filed 2010·Granted May 6, 2014·27 cites·23 claims
- 5092US6461967B2Material removal method for forming a structureMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 8, 2002·44 cites·28 claims
Showing the top 50 of 387 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →