Inventor · disambiguated record
Sharon N. Farrens
Also filed as: FARRENS SHARON · FARRENS SHARON N · FARRENS SHARON NANNETTE
16 granted patents·2 pending applications·732 citations·filing 1998–2023
94Inventor score
Files withGLO AB7SILICON GENESIS CORP4MICRON TECHNOLOGY INC3META PLATFORMS TECH LLC2FACEBOOK TECH LLC1
Top patents by PatentIndex Score
18 records- 0197US9893041B2Method of forming an array of a multi-device unit cellGLO AB·Filed 2017·Granted Feb 13, 2018·29 cites·13 claims
- 0297US6908832B2In situ plasma wafer bonding methodSILICON GENESIS CORP·Filed 2003·Granted Jun 21, 2005·134 cites·37 claims
- 0397US6180496B1In situ plasma wafer bonding methodSILICON GENESIS CORP·Filed 1998·Granted Jan 30, 2001·249 cites·8 claims
- 0496US10193038B2Through backplane laser irradiation for die transferGLO AB·Filed 2017·Granted Jan 29, 2019·22 cites·14 claims
- 0596US6534381B2Method for fabricating multi-layered substratesSILICON GENESIS CORP·Filed 2000·Granted Mar 18, 2003·139 cites·25 claims
- 0695US10177123B2Light emitting diode array on a backplane and method of making thereofGLO AB·Filed 2015·Granted Jan 8, 2019·30 cites·47 claims
- 0795US6645828B1In situ plasma wafer bonding methodSILICON GENESIS CORP·Filed 2000·Granted Nov 11, 2003·98 cites·27 claims
- 0893US10714464B2Method of selectively transferring LED die to a backplane using height controlled bonding structuresGLO AB·Filed 2017·Granted Jul 14, 2020·11 cites·15 claims
- 0993US10236447B2Selective die repair on a light emitting device assemblyGLO AB·Filed 2017·Granted Mar 19, 2019·10 cites·16 claims
- 1081US2023253524A1Selectively bonding light-emitting devices via a pulsed laserMETA PLATFORMS TECH LLC·Filed 2023·Application pending·0 cites
- 1180US9472518B2Semiconductor structures including carrier wafers and methods of using such semiconductor structuresMICRON TECHNOLOGY INC·Filed 2014·Granted Oct 18, 2016·4 cites·29 claims
- 1278US9716023B2Methods for temporarily bonding a device wafer to a carrier wafer, and related assembliesMICRON TECHNOLOGY INC·Filed 2014·Granted Jul 25, 2017·4 cites·18 claims
- 1377US11735689B2Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heatingFACEBOOK TECH LLC·Filed 2022·Granted Aug 22, 2023·0 cites·20 claims
- 1477US10693051B2Through backplane laser irradiation for die transferGLO AB·Filed 2019·Granted Jun 23, 2020·2 cites·6 claims
- 1553US10128142B2Semiconductor structures including carrier wafers and attached device wafers, and methods of forming such semiconductor structuresMICRON TECHNOLOGY INC·Filed 2016·Granted Nov 13, 2018·0 cites·21 claims
- 1652US10553571B2Method of forming an array of a multi-device unit cellGLO AB·Filed 2018·Granted Feb 4, 2020·0 cites·14 claims
- 1746US12394748B2Substrate bondingPLESSEY SEMICONDUCTORS LTD·Filed 2020·Granted Aug 19, 2025·0 cites·14 claims
- 1844US2022352441A1Cu pads for reduced dishing in low temperature annealing and bondingMETA PLATFORMS TECH LLC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →