Inventor · disambiguated record
Chuan-Jane Chao
Also filed as: CHAO CHUAN-JANE
14 granted patents·1 pending application·83 citations·filing 1999–2014
91Inventor score
Files withWINBOND ELECTRONICS CORP5RICHWAVE TECHNOLOGY CORP4HUANG CHIH-WEI2PENG KUO-JUI1TAIWAN SEMICONDUCTOR MFG1
Top patents by PatentIndex Score
15 records- 0188US9052332B2Piezoresistive type Z-axis accelerometerHUANG CHIH-WEI·Filed 2012·Granted Jun 9, 2015·9 cites·15 claims
- 0283US7692493B1High-efficiency single to differential amplifierRICHWAVE TECHNOLOGY CORP·Filed 2009·Granted Apr 6, 2010·13 cites·23 claims
- 0377US8026767B2Adaptive bias circuit and system thereofRICHWAVE TECHNOLOGY CORP·Filed 2009·Granted Sep 27, 2011·9 cites·25 claims
- 0468US6858900B2ESD protection devices and methods to reduce trigger voltageWINBOND ELECTRONICS CORP·Filed 2001·Granted Feb 22, 2005·14 cites·14 claims
- 0565US7671704B2LC resonant circuitRICHWAVE TECHNOLOGY CORP·Filed 2007·Granted Mar 2, 2010·3 cites·12 claims
- 0664US6870387B2Method and test structures for measuring interconnect coupling capacitance in an IC chipWINBOND ELECTRONICS CORP·Filed 2003·Granted Mar 22, 2005·15 cites·13 claims
- 0761US8904868B2Sensing apparatusHUANG CHIH-WEI·Filed 2012·Granted Dec 9, 2014·1 cites·9 claims
- 0858US6377067B1Testing method for buried strap and deep trench leakage currentWINBOND ELECTRONICS CORP·Filed 2000·Granted Apr 23, 2002·7 cites·21 claims
- 0947US6541325B2Method for fabricating a capacitor device with BiCMOS process and the capacitor device formed therebyWINDBOND ELECTRONICS CORP·Filed 2002·Granted Apr 1, 2003·3 cites·10 claims
- 1046US8580627B2Compound semiconductor device and method for fabricating the samePENG KUO-JUI·Filed 2010·Granted Nov 12, 2013·1 cites·6 claims
- 1138US9088252B2Fixed voltage generating circuitRICHWAVE TECHNOLOGY CORP·Filed 2014·Granted Jul 21, 2015·0 cites·20 claims
- 1237US6292393B1Method for extracting substrate coupling coefficient of a flash memoryWINBOND ELECTRONICS CORP·Filed 2000·Granted Sep 18, 2001·2 cites·4 claims
- 1336US2002118035A1Testing method for buried strap and deep trench leakage currentWINBOND ELECTRONICS CORP TAIWA·Filed 2002·Application pending·0 cites
- 1435US6046062AMethod to monitor the kink effectTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Apr 4, 2000·5 cites·14 claims
- 1531US6392285B1Method for fabricating a capacitor device with BiCMOS process and the capacitor device formed therebyWINBOND ELECTRONICS CORP·Filed 1999·Granted May 21, 2002·1 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →