Inventor · disambiguated record
Rainer Popp
Also filed as: POPP RAINER
16 granted patents·1 pending application·99 citations·filing 2004–2023
92Inventor score
Files withSEMIKRON ELEKTRONIK GMBH7SEMIKRON ELEKTRONIK GMBH & CO KG7LEDERER MARCO1POPP RAINER1SEMIKRON ELECTRONIK GMBH & CO1
Top patents by PatentIndex Score
17 records- 0189US7589418B2Pressure contact power semiconductor moduleSEMIKRON ELEKTRONIK GMBH·Filed 2007·Granted Sep 15, 2009·20 cites·7 claims
- 0282US10763182B2Power semiconductor device comprising a housing, and method for producing a power semiconductor deviceSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2019·Granted Sep 1, 2020·4 cites·14 claims
- 0382US7495324B2Power semiconductor moduleSEMIKRON ELEKTRONIK GMBH·Filed 2007·Granted Feb 24, 2009·11 cites·12 claims
- 0480US9907215B2Power electronic subassembly with capacitorSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2016·Granted Feb 27, 2018·4 cites·16 claims
- 0579US7592698B2Power semiconductor modules having a cooling component and method for producing themSEMIKRON ELEKTRONIK GMBH·Filed 2007·Granted Sep 22, 2009·9 cites·6 claims
- 0675US6979204B2Pressure piece for use in a power semiconductor moduleSEMIKRON ELEKTRONIK GMBH·Filed 2004·Granted Dec 27, 2005·23 cites·7 claims
- 0773US7683472B2Power semiconductor modules and method for producing themSEMIKRON ELECTRONIK GMBH & CO·Filed 2007·Granted Mar 23, 2010·10 cites·9 claims
- 0870US10893602B2Method for producing a power electronics systemSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2018·Granted Jan 12, 2021·2 cites·10 claims
- 0968US7821791B2Housing for a power moduleSEMIKRON ELEKTRONIK GMBH·Filed 2007·Granted Oct 26, 2010·3 cites·10 claims
- 1066US8338942B2Power semiconductor module with connection elements electrically insulated from one anotherLEDERER MARCO·Filed 2007·Granted Dec 25, 2012·4 cites·10 claims
- 1163US12035514B2Liquid cooling device for the arrangement of a power semiconductor deviceSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2022·Granted Jul 9, 2024·0 cites·13 claims
- 1259US11837525B1Module having a moulded plastic body and a multiplicity of load terminal elements and power semiconductor device therewithSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2023·Granted Dec 5, 2023·0 cites·15 claims
- 1358USD906240SPowercore moduleSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2018·Granted Dec 29, 2020·6 cites·1 claims
- 1458US7944701B2Housing for a power semiconductor moduleSEMIKRON ELEKTRONIK GMBH·Filed 2008·Granted May 17, 2011·1 cites·6 claims
- 1555US8203205B2Power semiconductor module having a substrate and a pressure devicePOPP RAINER·Filed 2008·Granted Jun 19, 2012·2 cites·14 claims
- 1641USD925448SPowercore moduleSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2020·Granted Jul 20, 2021·0 cites·1 claims
- 1741US2007104926A1Circuit device in particular frequency converterSEMIKRON ELEKTRONIK GMBH·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →