Inventor · disambiguated record
Haruhiko Sekiya
Also filed as: SEKIYA HARUHIKO
7 granted patents·52 citations·filing 1998–2020
81Inventor score
Technology areasG01L
Top patents by PatentIndex Score
7 records- 0178US8286496B2Fluid pressure sensor incorporating flexible circuit boardSEKIYA HARUHIKO·Filed 2010·Granted Oct 16, 2012·10 cites·10 claims
- 0277US10274388B2Pressure sensor including sensor module having diaphragm and joint attached with the sensor moduleNAGANO KEIKI CO LTD·Filed 2017·Granted Apr 30, 2019·3 cites·5 claims
- 0375US10145749B2Physical quantity measuring device including a sensor module and a joint for locking the sensor moduleNAGANO KEIKI CO LTD·Filed 2016·Granted Dec 4, 2018·2 cites·4 claims
- 0472US6298730B1Pressure sensorNAGANO KEIKI CO LTD·Filed 1998·Granted Oct 9, 2001·34 cites·23 claims
- 0570US10113926B2Ceramic sensor module including diaphragm and cylindrical portion integrated with the diaphragmNAGANO KEIKI CO LTD·Filed 2017·Granted Oct 30, 2018·1 cites·4 claims
- 0664US9772242B2Physical quantity measuring sensor including an O-ring between a cylindrical portion and a cylindrical projectionNAGANO KEIKI CO LTD·Filed 2014·Granted Sep 26, 2017·2 cites·4 claims
- 0756US11293820B2Physical quantity measurement including improved corrosion protectionNAGANO KEIKI CO LTD·Filed 2020·Granted Apr 5, 2022·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →