Inventor · disambiguated record
Tien-Yu Lee
Also filed as: LEE TIEN · LEE TIEN YU T · LEE TIEN-YU · LEE TIEN-YU TOM
31 granted patents·5 pending applications·892 citations·filing 1990–2020
97Inventor score
Files withMOTOROLA INC10XILINX INC9FREESCALE SEMICONDUCTOR INC4LITE ON OPTO TECH CHANGZHOU CO LTD4TRACHT NEIL T2
Top patents by PatentIndex Score
36 records- 0197US7405102B2Methods and apparatus for thermal management in a multi-layer embedded chip structureFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Jul 29, 2008·69 cites·12 claims
- 0296US10529645B2Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal managementXILINX INC·Filed 2017·Granted Jan 7, 2020·26 cites·20 claims
- 0396US5391285AAdjustable plating cell for uniform bump plating of semiconductor wafersMOTOROLA INC·Filed 1994·Granted Feb 21, 1995·193 cites·19 claims
- 0495US10043730B2Stacked silicon package assembly having an enhanced lidXILINX INC·Filed 2015·Granted Aug 7, 2018·19 cites·19 claims
- 0592US7892882B2Methods and apparatus for a semiconductor device package with improved thermal performanceFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Feb 22, 2011·26 cites·10 claims
- 0692US6040624ASemiconductor device package and methodMOTOROLA INC·Filed 1997·Granted Mar 21, 2000·242 cites·4 claims
- 0787US5915463AHeat dissipation apparatus and methodMOTOROLA INC·Filed 1996·Granted Jun 29, 1999·93 cites·20 claims
- 0880US6081037ASemiconductor component having a semiconductor chip mounted to a chip mountMOTOROLA INC·Filed 1998·Granted Jun 27, 2000·67 cites·5 claims
- 0979US11315858B1Chip package assembly with enhanced solder resist crack resistanceXILINX INC·Filed 2020·Granted Apr 26, 2022·1 cites·20 claims
- 1077US8217511B2Redistributed chip packaging with thermal contact to device backsideTRACHT NEIL T·Filed 2007·Granted Jul 10, 2012·7 cites·11 claims
- 1177US5487355ASemiconductor crystal growth methodMOTOROLA INC·Filed 1995·Granted Jan 30, 1996·33 cites·13 claims
- 1275US10319606B1Chip package assembly with enhanced interconnects and method for fabricating the sameXILINX INC·Filed 2017·Granted Jun 11, 2019·2 cites·20 claims
- 1375US6194990B1Printed circuit board with a multilayer integral thin-film metal resistor and method thereforMOTOROLA INC·Filed 1999·Granted Feb 27, 2001·33 cites·9 claims
- 1473US7812448B2Electronic device including a conductive stud over a bonding pad regionFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Oct 12, 2010·5 cites·20 claims
- 1572US6440318B1Printed circuit board with a multilayer integral thin-film metal resistor and method thereforMOTOROLA INC·Filed 2000·Granted Aug 27, 2002·15 cites·5 claims
- 1670US6352192B1System and method to control solder reflow furnace with wafer surface characterizationMOTOROLA INC·Filed 2000·Granted Mar 5, 2002·15 cites·11 claims
- 1769US11355412B2Stacked silicon package assembly having thermal managementXILINX INC·Filed 2018·Granted Jun 7, 2022·1 cites·18 claims
- 1867US9204542B1Multi-use package substrateXILINX INC·Filed 2013·Granted Dec 1, 2015·2 cites·20 claims
- 1966US9455387B1LED package structure and manufacturing method thereofLITE-ON OPTO TECH (CHANGZHOU) CO LTD·Filed 2015·Granted Sep 27, 2016·1 cites·8 claims
- 2063US6418016B1System and method for cooling using an oscillatory impinging jetMOTOROLA INC·Filed 2001·Granted Jul 9, 2002·9 cites·19 claims
- 2161US8216864B2LED device and packaging method thereofWU CHIA-HAO·Filed 2009·Granted Jul 10, 2012·1 cites·3 claims
- 2260US7741651B2Light emitting diodeLITE ON TECHNOLOGY CORP·Filed 2007·Granted Jun 22, 2010·1 cites·14 claims
- 2357US10527670B2Testing system for lid-less integrated circuit packagesXILINX INC·Filed 2017·Granted Jan 7, 2020·0 cites·20 claims
- 2457US5050114ASimulation of two-phase liquid cooling for thermal prediction of direct liquid cooling schemesMOTOROLA INC·Filed 1990·Granted Sep 17, 1991·26 cites·6 claims
- 2554US2012194067A1Led deviceWU CHIA-HAO·Filed 2012·Application pending·0 cites
- 2650US9653669B2LED package structureLITE-ON OPTO TECH (CHANGZHOU) CO LTD·Filed 2016·Granted May 16, 2017·0 cites·20 claims
- 2749US6897562B2Electronic component and method of manufacturing sameMOTOROLA CORP·Filed 2003·Granted May 24, 2005·4 cites·21 claims
- 2848US11257795B2Chip-scale LED package structureLITE ON OPTO TECH CHANGZHOU CO LTD·Filed 2019·Granted Feb 22, 2022·0 cites·20 claims
- 2948US10930611B1Solder joints for board level reliabilityXILINX INC·Filed 2019·Granted Feb 23, 2021·0 cites·18 claims
- 3048US2010200879A1Photoelectric semiconductor deviceLEE TIEN-YU·Filed 2009·Application pending·0 cites
- 3147US10096502B2Method and apparatus for assembling and testing a multi-integrated circuit packageXILINX INC·Filed 2016·Granted Oct 9, 2018·0 cites·16 claims
- 3245US6906900B2Structure and method of thermally protecting power devices for airbag deploymentFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Jun 14, 2005·1 cites·21 claims
- 3345US2020176648A1Light emitting package structure and method of manufacturing the sameLITE ON OPTO TECH CHANGZHOU CO LTD·Filed 2019·Application pending·0 cites
- 3444US8530346B2Process of forming an electronic device including a conductive stud over a bonding pad regionRAMANATHAN LAKSHMI N·Filed 2010·Granted Sep 10, 2013·0 cites·20 claims
- 3544US2012252169A1Redistributed chip packaging with thermal contact to device backsideTRACHT NEIL T·Filed 2012·Application pending·0 cites
- 3639US2007056713A1Integrated cooling design with heat pipesCHIRIAC VICTOR A·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →